1SG280HN3F43E3VG

The Intel Stratix 10 GX 1SG280HN3F43E3VG is a high-density, high-performance FPGA built on the Stratix® 10 GX family architecture. It leverages the Intel Hyperflex™ core architecture and 14 nm tri‑gate (FinFET) technology to address applications that require substantial logic capacity, large on‑chip memory, and high‑speed serial connectivity.

This device is targeted at systems that demand high bandwidth and heavy processing throughput—such as data center networking, high‑speed communications, and compute‑accelerated platforms—while providing an extended temperature grade and surface‑mount 1760‑BBGA package for compact board implementations.

Key Features

• Core architecture — Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) technology, delivering increased core performance for demanding logic workloads.
• Logic density — 2,800,000 logic elements to implement large, complex designs and high‑fanout logic networks.
• On‑chip memory — 240,123,904 total RAM bits of embedded memory for large buffering, packet processing, and scratchpad storage.
• High‑speed transceivers & interfaces — Family features include heterogeneous 3D SiP transceiver tiles and transceiver data rates up to 28.3 Gbps (chip‑to‑chip/module and backplane), enabling high‑bandwidth serial links and backplane applications.
• Hard IP support (family) — Family includes hard PCI Express® Gen3 x16, 10G Ethernet FEC, and hard memory controllers supporting DDR4 up to 2666 Mbps per pin, providing integration options for high‑performance systems.
• DSP and compute — Family variable‑precision DSP blocks and reported high compute capability for signal processing and acceleration workloads.
• I/O and package — 688 I/Os in a surface‑mount 1760‑BBGA (1760‑FBGA supplier package, 42.5 × 42.5 mm) for dense I/O routing and compact board area usage.
• Power and supply — Core voltage supply range 770 mV to 970 mV to match platform power architectures and power‑management strategies.
• Temperature and grade — Extended grade with operating temperature range 0 °C to 100 °C, suitable for a wide range of commercial and higher‑temperature applications.
• Compliance — RoHS compliant.

Typical Applications

• High‑speed networking and switching — Leverages high logic density, large on‑chip RAM, and high‑speed transceivers to implement packet processing, switching fabrics, and line cards.
• Compute acceleration — Dense logic and DSP resources suit hardware acceleration for data‑plane processing, encryption/decryption, and algorithm offload.
• Backplane and optical modules — Transceiver capability to support chip‑to‑chip, module, and backplane links at multi‑Gb/s rates for telecom and data center interconnects.
• High‑performance memory interfaces — Hard memory controller family support for DDR4 rates up to 2666 Mbps per pin enables high‑bandwidth memory subsystems.

Unique Advantages

• Massive logic capacity: 2.8 million logic elements provide headroom for large, feature‑rich FPGA designs without partitioning across multiple devices.
• Large on‑chip memory: Over 240 million bits of embedded RAM reduce external memory dependencies and improve determinism for buffering and packet handling.
• High‑speed serial capability: Family transceivers rated up to 28.3 Gbps and heterogeneous 3D SiP tiles support scalable, high‑bandwidth link architectures.
• Compact, high‑I/O package: 1760‑BBGA package with 688 I/Os delivers dense connectivity in a 42.5 × 42.5 mm supplier package footprint.
• Platform flexibility: Wide core supply window (770 mV–970 mV) and extensive family hard IP options simplify integration into varied power and system architectures.
• Commercial extended grade: 0 °C to 100 °C operating range and RoHS compliance for broader deployment environments.

Why Choose 1SG280HN3F43E3VG?

The 1SG280HN3F43E3VG Stratix 10 GX FPGA combines very high logic density, substantial embedded memory, and high‑speed serial connectivity in a compact 1760‑BBGA package. It is well suited for designers building bandwidth‑intensive, compute‑heavy systems where on‑chip resources and transceiver performance are decisive.

Choosing this device provides a scalable platform backed by Stratix 10 family innovations—enabling complex, integrated systems with reduced external component count and explicit support for high‑throughput interfaces and memory subsystems.

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