1SG280HU1F50I2VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 93 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HU1F50I2VGAS – Stratix® 10 GX FPGA, 704 I/O, 2397-BBGA FCBGA
The 1SG280HU1F50I2VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) offered in a 2397-BBGA FCBGA package. It combines a high logic capacity with large on-chip memory and extensive I/O to address demanding, high-bandwidth digital designs.
Built on the Stratix 10 GX family architecture, this device targets applications that require significant programmable logic, high-speed serial connectivity, and industrial temperature operation while operating at a low core voltage range.
Key Features
- Core architecture: Implements the Intel Stratix 10 GX family architecture including the Intel Hyperflex core innovations described in the device overview.
- Logic capacity: 2,800,000 logic elements, providing substantial programmable fabric for complex logic and compute functions.
- On-chip memory: 240,123,904 total RAM bits with family M20K internal SRAM resources referenced in the device overview.
- High-speed transceivers: Family-level support for up to 96 full-duplex transceiver channels with transceiver data rates up to 28.3 Gbps (family specification noted in the device overview).
- I/O and package: 704 I/O pins in a 2397-BBGA, FCBGA package (supplier device package: 2397-FBGA, FC 50×50), enabling dense external connectivity.
- Power and supply: Core voltage supply range 770 mV to 970 mV, suitable for low-voltage core operation.
- Operating range and grade: Industrial grade operation with an ambient operating temperature range of −40 °C to 100 °C.
- DSP and compute: Family-level variable precision DSP blocks and high compute performance capabilities are part of the Stratix 10 GX/SX device overview.
- System integration features: Device overview describes embedded capabilities such as hard memory controllers, PLLs, and selectable hard IP blocks available within the Stratix 10 family.
Typical Applications
- High-speed networking and telecommunications — Large logic capacity, extensive on-chip RAM and family-level high-speed transceivers make the device suitable for packet processing, switching, and line-rate protocol implementations.
- Data center acceleration — Massive programmable fabric and DSP resources support custom acceleration tasks and high-throughput data-path designs.
- Backplane and board-level interconnect — Up to 704 I/O and family transceiver support enable demanding backplane, module-to-module, and board-level high-speed links.
- Signal processing and DSP — Large RAM and variable precision DSP capability support complex fixed- and floating-point signal processing workloads.
Unique Advantages
- High programmable capacity: 2.8 million logic elements deliver ample fabric for complex, partitioned designs and large IP integration without immediate need for external silicon.
- Large on-chip memory: 240,123,904 total RAM bits reduce dependence on external memory for many buffering and data-path requirements.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial and harsh-environment systems.
- Dense I/O and package: 704 I/O in a 2397-BBGA FCBGA package provides a compact, high-density mounting option for space-constrained boards.
- Low-voltage core operation: 770 mV to 970 mV supply range aligns with modern low-power core domains.
- Family-level high-speed connectivity: Stratix 10 GX family transceiver capabilities support design requirements for multi-gigabit links and high-bandwidth I/O.
Why Choose 1SG280HU1F50I2VGAS?
The 1SG280HU1F50I2VGAS positions itself as a high-capacity, industrial-grade Stratix 10 GX FPGA option for engineers who need substantial logic, large on-chip memory, and robust I/O in a compact FCBGA package. Its specified operating temperature range and core voltage domain make it appropriate for industrial system deployments that demand both density and resilience.
Designers targeting high-bandwidth networking, data center acceleration, and advanced DSP workloads will find the device’s combination of logic elements, RAM, I/O count, and family-level transceiver capability well suited to scalable, long-lived designs supported by the Stratix 10 architecture.
If you would like pricing, availability, or a formal quote for 1SG280HU1F50I2VGAS, request a quote or submit an inquiry to our sales team today.

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