1SG280HU2F50E2LG

The 1SG280HU2F50E2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA (FCBGA) package designed for high-performance, high-density programmable logic applications. It provides 2,800,000 logic elements, 240,123,904 bits of on-chip RAM and up to 704 I/O pins to support complex system designs requiring large logic capacity and extensive IO connectivity.

Built on the Stratix 10 GX device family architecture, this device leverages family-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm FinFET process to address demanding bandwidth and processing requirements while offering a package and power profile suitable for advanced embedded and communications systems.

Key Features

• Logic Capacity  2,800,000 logic elements provide the fabric for large-scale digital designs and complex IP integration.
• Embedded Memory  240,123,904 total RAM bits of on-chip memory to support large buffering, lookup tables, and state storage without external memory in many use cases.
• I/O Count  704 I/O pins to enable broad external interfacing and parallel connectivity for high-channel-count applications.
• Package & Mounting  2397-BBGA (FCBGA) package, supplier device package listed as 2397-FBGA, FC (50×50); surface-mount component for board-level integration.
• Power  Core voltage supply range of 820 mV to 880 mV, allowing designers to plan power distribution and regulation for the device.
• Operating Temperature  Extended-grade operating range of 0 °C to 100 °C for a variety of commercial and industrial-adjacent environments.
• Standards & Compliance  RoHS compliant, meeting common environmental substance regulations.
• Stratix 10 GX Family Innovations  Family-level features include the Intel Hyperflex core architecture, 14 nm tri-gate (FinFET) process, heterogeneous 3D SiP transceiver tiles and high-speed transceiver technologies documented in the Stratix 10 GX device overview.

Typical Applications

• High-Performance Networking  Large logic capacity and high I/O count enable packet processing, switching fabrics, and programmable network accelerators.
• Telecommunications & Data Centers  On-chip memory and extensive I/O support buffering, protocol offload, and custom packet-handling engines.
• Signal Processing & Acceleration  Dense logic and embedded RAM support large, parallel DSP pipelines and hardware accelerators for compute-intensive workloads.
• Prototyping & System Integration  High logic element count and rich I/O make the device suitable for prototyping complex SoC functions and integrating multiple IP blocks on a single device.

Unique Advantages

• Massive Logic Density: 2.8 million logic elements give designers the headroom to implement large, integrated systems-on-FPGA without immediate partitioning across multiple devices.
• Large On‑Chip Memory: 240,123,904 bits of RAM reduce dependency on external memory for many buffering and stateful functions, simplifying board design and improving latency.
• High I/O Count: 704 I/O pins allow broad external interfacing, enabling parallel data paths and connectivity to numerous peripherals or high-channel-count systems.
• Surface-Mount, High-Density Package: The 2397-BBGA FCBGA package supports dense board-level integration for space-constrained, high-performance systems.
• Family-Level Architectural Benefits: Leveraging Stratix 10 GX family innovations such as the Hyperflex core and 14 nm FinFET process provides a platform designed for strong performance per watt and advanced transceiver capabilities (as documented in the device family overview).
• Regulatory Compliance: RoHS compliance supports environmentally constrained procurement and manufacturing requirements.

Why Choose 1SG280HU2F50E2LG?

The 1SG280HU2F50E2LG positions itself as a high-capacity Stratix 10 GX FPGA option for designs that demand extensive logic, significant on-chip memory, and a high pin count in a compact surface-mount BBGA package. Its extended-grade temperature range and documented family-level architectural innovations make it suitable for demanding networking, compute acceleration, and system-integration projects where programmable logic density and connectivity are critical.

For engineering teams and procurement seeking a Stratix 10 GX device with large logic element count, substantial embedded RAM, and broad I/O capability, this part offers a scalable platform supported by the Stratix 10 device family documentation and Intel’s ecosystem for advanced FPGA development.

Request a quote or submit a quote for the 1SG280HU2F50E2LG to evaluate its fit in your next high-density FPGA project.