1SG280HU2F50E2LGS3

The 1SG280HU2F50E2LGS3 is a Stratix® 10 GX field-programmable gate array (FPGA) designed for high-performance, high-bandwidth system designs. The device leverages the Intel Stratix 10 family architecture—including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology—to deliver scalable programmable logic, on-chip memory, and extensive I/O for demanding computing and communications applications.

Key Features

• Programmable logic capacity — 2,800,000 logic elements supported for large-scale integration and complex logic implementations.
• Logic block resources — 350,000 logic blocks provide fine-grained resources for mapping large designs across the fabric.
• On-chip memory — 240,123,904 total RAM bits to support buffering, packet processing, and data-intensive algorithms.
• I/O density — 704 I/Os to interface with high-pin-count peripherals, memory, and transceiver modules.
• Package & mounting — 2397-BBGA (FCBGA) package in a 50 mm × 50 mm footprint with surface-mount mounting for compact system integration.
• Power — Core voltage supply range of 820 mV to 880 mV to match system power rails and power-management designs.
• Environmental & grade — Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
• Family innovations — Built on Intel Hyperflex core architecture and 14 nm FinFET process technology for improved core performance and power efficiency (series-level features).

Typical Applications

• High-speed networking — Implement packet processing, switching, and protocol offload where high logic capacity and dense I/O are required.
• Data center acceleration — Large on-chip memory and logic resources support custom acceleration engines and data-path optimization.
• Telecommunications infrastructure — Use for high-bandwidth transport, fronthaul/backhaul processing and custom PHY implementations.
• Advanced signal processing — Suitable for real-time DSP, complex filtering, and algorithm acceleration that demand substantial logic and memory.

Unique Advantages

• High programmable capacity: 2.8 million logic elements enable consolidation of large subsystems into a single device, reducing BOM complexity.
• Large on-chip RAM: 240,123,904 bits of RAM provide headroom for buffering, packet queues, and in-line data processing without immediate external memory dependence.
• Dense I/O support: 704 I/Os accommodate multiple high-pin interfaces and complex board-level interconnect requirements.
• Compact, production-ready package: 2397-BBGA (FCBGA) in a 50×50 mm package supports high-pin-count integration in space-constrained designs.
• Optimized power window: Narrow core voltage range (820 mV–880 mV) supports predictable power management and supply design.
• Extended-grade operation: 0 °C to 100 °C operating range and RoHS compliance make the device suitable for standard commercial and extended-temperature applications.

Why Choose 1SG280HU2F50E2LGS3?

The 1SG280HU2F50E2LGS3 positions itself for systems that require substantial programmable logic, significant on-chip memory, and a high count of I/Os in a single FPGA package. It is well suited to engineering teams developing high-performance networking, data-center acceleration, telecommunication equipment, and advanced signal-processing platforms that benefit from the Stratix 10 family’s architectural innovations.

Choosing this device provides a balance of logic capacity, memory resources, and I/O density, backed by the Stratix 10 series architecture and Intel 14 nm FinFET family-level features—enabling scalable designs and long-term platform support.

If you would like pricing, availability, or a formal quote for 1SG280HU2F50E2LGS3, please request a quote or submit a quote request through your usual procurement channel.