1SG280HU2F50E2VGS3

The 1SG280HU2F50E2VGS3 is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. It delivers 2,800,000 logic elements, 240,123,904 bits of on-chip RAM and 704 I/O pins in a surface-mount 2397-FBGA (50×50) footprint for high-density, high-throughput designs.

Based on the Stratix 10 GX family architecture, the device targets applications requiring substantial programmable logic, large on-chip memory, and extensive I/O. Family-level innovations such as the Intel Hyperflex core architecture and advanced FinFET process technology provide the series-level performance and integration that this device brings to system designs.

Key Features

• Logic Capacity  2,800,000 logic elements provide large-scale programmable logic resources for complex algorithms and custom hardware acceleration.
• On-Chip Memory  240,123,904 total RAM bits support extensive buffering, data storage and high-bandwidth local memory requirements.
• I/O Density  704 I/O pins accommodate broad peripheral interfacing and dense board-level connectivity in compact system designs.
• Package & Mounting  2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC 50×50) with surface-mount construction for high-pin-count board integration.
• Power Supply Range  Core voltage supply range of 770 mV to 970 mV enables operation across typical Stratix 10 power rails.
• Operating Temperature  Rated for 0 °C to 100 °C operating temperature suitable for extended-grade environments.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.
• Stratix 10 GX Family Technologies  Series-level features include the Intel Hyperflex core architecture, Intel 14 nm FinFET process, heterogeneous 3D SiP transceiver tiles and family hard IP (as documented in the Stratix 10 GX/SX device overview).

Typical Applications

• High‑Performance Networking  Large logic capacity and extensive I/O make this device suitable for packet processing, switch fabric and line-rate protocol offload.
• Telecom & Infrastructure  On-chip memory and family transceiver technologies address bandwidth‑intensive tasks common in telecom line cards and aggregation systems.
• Data Center Acceleration  Programmable logic density supports custom accelerators, data-path engines and protocol bridging for data center appliances.
• Advanced Signal Processing  Significant RAM and logic resources enable real‑time processing, filtering and algorithm implementation in communications and instrumentation equipment.

Unique Advantages

• High Logic Density:  2.8 million logic elements allow consolidation of complex subsystems into a single device, reducing inter-component latency and board-level complexity.
• Large On‑Chip Memory:  240,123,904 bits of RAM provide abundant local storage for buffering and data-path acceleration without relying solely on external memory.
• Extensive I/O Count:  704 I/Os give design flexibility for multiple high-speed interfaces and parallel sensor or peripheral connections.
• Compact High‑Pin Package:  2397-BBGA FCBGA (50×50) package provides dense pinout in a surface-mount form factor for space-constrained, high-performance PCBs.
• Family-Level Performance Enhancements:  Built on the Stratix 10 GX family architecture, benefiting from Hyperflex core principles and 14 nm FinFET process innovations documented for the family.
• Extended Grade:  Rated grade and a 0 °C to 100 °C operating range support extended‑temperature system deployments.

Why Choose 1SG280HU2F50E2VGS3?

The 1SG280HU2F50E2VGS3 combines very high programmable logic capacity, substantial embedded memory and a large I/O count in a single, surface-mount FCBGA package. It is positioned for engineers building high-bandwidth, compute‑intensive systems who need consolidation of functions and flexible I/O in a compact footprint.

Choosing this Stratix 10 GX device offers long-term design scalability tied to the family’s documented architectural benefits and a RoHS‑compliant manufacturing profile, making it suitable for demanding communications, data center and signal-processing applications.

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