1SG280HU2F50E2VGAS

The 1SG280HU2F50E2VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-ball FCBGA package. It integrates a high-performance Hyperflex core architecture and advanced system-level features intended for bandwidth- and compute-intensive applications.

With 2,800,000 logic elements and 240,123,904 total RAM bits, this device targets designs that require large programmable fabric, dense on-chip memory, and substantial I/O capacity while operating from 770 mV to 970 mV and across an extended temperature range of 0 °C to 100 °C.

Key Features

• Core & Architecture  Built on the Intel Stratix 10 GX family architecture with Hyperflex core innovations for enhanced core performance as described in the device overview.
• Logic Capacity  2,800,000 logic elements provide expansive programmable fabric for complex logic and system integration.
• On‑Chip Memory  240,123,904 total RAM bits for large internal buffering, state storage, and memory-intensive designs.
• I/O and Packaging  Up to 704 I/Os in a 2397‑BBGA (FCBGA) package; supplier device package listed as 2397‑FBGA, FC (50×50). Surface-mount mounting type.
• Power and Temperature  Core supply range from 770 mV to 970 mV and an operating temperature range of 0 °C to 100 °C; device grade is Extended.
• High‑Speed and System IP (Family Features)  Device family overview highlights advanced transceiver tiles, fractional synthesis PLLs, hard PCI Express Gen3 IP, and variable-precision DSP capability—features described for the Stratix 10 GX family.

Typical Applications

• High‑Performance Networking  Use for switching, routing, and packet-processing systems where large logic capacity and extensive I/O enable complex traffic handling and protocol offload.
• Data Center Acceleration  Suitable for acceleration tasks that require dense compute fabric and large on-chip memory for buffering and stateful processing.
• Communications Infrastructure  Deploy in board- and system-level backplane or module designs benefiting from high I/O count and family-level transceiver and PCIe IP capabilities.
• Advanced Signal Processing  Apply to DSP-intensive applications that leverage the device family’s variable-precision DSP and large internal RAM resources.

Unique Advantages

• Massive Programmable Fabric: 2,800,000 logic elements deliver capacity for highly integrated, multi-function designs without splitting logic across multiple devices.
• Large On‑Chip Memory: 240,123,904 total RAM bits reduce dependence on external memory for buffering and accelerate data‑path designs.
• High I/O Density: 704 I/Os and a 2397‑BBGA FCBGA package provide broad connectivity options for complex system interfaces.
• Family-Level System IP: Stratix 10 GX family features—such as advanced transceiver tiles and hard PCIe—enable integration of high-speed protocols and system-level functions.
• Extended Operating Range: Extended device grade with 0 °C to 100 °C operation supports deployment in a variety of controlled-environment applications.

Why Choose 1SG280HU2F50E2VGAS?

This Stratix® 10 GX FPGA part combines very large logic capacity, substantial on-chip memory, and high I/O density in a compact 2397‑ball FCBGA package. It is positioned for engineers building bandwidth- and compute-intensive systems that require a single-device solution for complex protocols, heavy DSP workloads, and dense integration.

Design teams seeking scalability and long-term platform capability will find value in the device’s fabric size, memory resources, and the Stratix 10 family’s system-level features. The extended-grade rating and defined voltage/temperature ranges support predictable integration into production systems.

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