1SG280HU1F50I2VG

The 1SG280HU1F50I2VG is an Intel Stratix® 10 GX field‑programmable gate array (FPGA) in a 2397‑BBGA FCBGA package. It implements the Stratix 10 GX family architecture and is targeted at advanced applications requiring high logic density, significant on‑chip memory, and extensive I/O capability.

Built around the Stratix 10 family innovations, this device combines a high‑performance FPGA core architecture with a large logic and memory resource set. It is suitable for designs that demand high throughput, flexible I/O, and operation across an industrial temperature range.

Key Features

• Core Architecture  Intel Stratix 10 family architecture and Hyperflex core innovations delivering higher core performance and improved power efficiency compared to prior high‑performance FPGA generations.
• Logic Capacity  2,800,000 logic elements to implement large, complex digital designs.
• On‑Chip Memory  240,123,904 total RAM bits, supporting substantial buffering, packet processing, and on‑chip storage requirements.
• I/O and Package  704 I/O pins in a 2397‑BBGA (FCBGA) package; supplier device package noted as 2397‑FBGA, FC (50×50). Surface‑mount package suitable for dense system integration.
• Power and Voltage  Specified core voltage supply range from 770 mV to 970 mV to support the device core power domains.
• Operating Range  Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliant.
• Family‑Level High‑Speed and System Features  Built on Stratix 10 GX family capabilities such as high‑performance DSP and fabric architecture, on‑chip M20K SRAM blocks, advanced PLLs, and integrated hard IP for high‑speed interfaces (as described in the Stratix 10 GX/SX device overview).

Typical Applications

• Networking & Communications  High‑density switching, line cards, and packet processing that require large logic arrays, abundant on‑chip memory, and extensive I/O.
• Data Center Acceleration  Compute and I/O acceleration tasks leveraging the device’s large logic and memory resources for custom acceleration kernels and buffering.
• High‑Speed I/O and Backplane Systems  Systems that require many I/O channels and a compact FCBGA package for board‑level integration within constrained form factors.
• Test, Measurement & Instrumentation  High‑throughput signal processing and protocol handling that benefit from the device’s logic density and memory capacity.

Unique Advantages

• High Logic Density: 2.8 million logic elements enable large, complex designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: 240,123,904 RAM bits provide ample capacity for buffering, packet queues, and state storage close to logic.
• Extensive I/O in a Compact Package: 704 I/O pins in a 2397‑BBGA FCBGA (50×50) package simplify board routing while supporting dense interface requirements.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in industrial environments.
• Family Innovations: Leverages Stratix 10 GX family features such as Hyperflex core architecture and advanced on‑chip memory and PLL structures to improve performance and power efficiency.
• RoHS Compliant: Environmentally compliant manufacturing and materials.

Why Choose 1SG280HU1F50I2VG?

The 1SG280HU1F50I2VG positions itself as a high‑capacity Stratix 10 GX FPGA option for engineers building bandwidth‑intensive, compute‑heavy systems. Its combination of 2.8 million logic elements, large on‑chip RAM, wide I/O count, and industrial temperature rating makes it suitable for demanding networking, data center acceleration, and instrumentation designs that require both scale and robustness.

Choosing this device provides a path to consolidate complex functionality into a single, high‑density FPGA package while leveraging the Stratix 10 family architecture and ecosystem for system‑level integration and long‑term scalability.

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