1SG280HU3F50I2VG

The 1SG280HU3F50I2VG is an Intel Stratix® 10 GX high-performance FPGA in a 2397-BBGA FCBGA package, offering 2,800,000 logic elements and 704 user I/O. Built on the Stratix® 10 GX family architecture, the device targets high-bandwidth, compute-intense applications that require large programmable fabric, high-speed transceivers, and industrial-grade operating range.

As part of the Stratix® 10 GX family, the device leverages the family’s Hyperflex core architecture and advanced transceiver and memory subsystems to deliver a combination of performance and integration suited for demanding communications, compute acceleration, and networking applications.

Key Features

• Core Logic  2,800,000 logic elements provide a large programmable fabric for complex logic, protocol processing, and custom compute pipelines.
• Hyperflex Architecture  Family-level Hyperflex core architecture designed to increase core performance and efficiency compared to previous-generation high-performance FPGAs.
• On-Chip Memory  240,123,904 total RAM bits of embedded memory, including M20K internal SRAM blocks for high-bandwidth local storage and buffering.
• High-Performance DSP  Variable-precision DSP blocks are available for heavy numeric workloads; family documentation reports high TFLOP-class compute capability for signal processing and algorithm acceleration.
• Transceivers & Interfaces  Family features include high-speed transceiver technology and heterogeneous 3D SiP transceiver tiles with transceiver data rates cited in family documentation for multi-gigabit serial links and protocol engines.
• I/O & Package  704 user I/O in a surface-mount 2397-BBGA (FCBGA) package; supplier package referenced as 2397-FBGA, FC (50×50) for compact board-level integration.
• Power Range  Core voltage supply range specified at 770 mV to 970 mV to support the device’s power and performance operating points.
• Industrial Temperature Grade  Specified operating temperature range from –40 °C to 100 °C, suitable for industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-Speed Networking and Switches  Use the large logic fabric and high-speed transceivers for packet processing, line-rate protocol handling, and adaptable forwarding engines.
• Data Center Acceleration  Implement custom compute kernels, compression, or encryption accelerators that benefit from large on-chip memory and dense DSP resources.
• Telecommunications Infrastructure  Deploy in fronthaul/backhaul and optical transport equipment where multi-gigabit serial links and protocol IP are required.
• Test & Measurement and Instrumentation  Leverage deterministic FPGA fabric and abundant I/O for real-time data acquisition, preprocessing, and high-rate streaming.

Unique Advantages

• Large, Scalable Logic Fabric: 2.8 million logic elements provide capacity for complex system-on-chip designs and extensive custom logic integration.
• Integrated High-Bandwidth Memory: Over 240 Mbit of on-chip RAM enables local buffering and fast data paths for compute and streaming applications.
• Industrial-Grade Thermal Range: –40 °C to 100 °C operating range supports deployment in industrial environments with extended temperature requirements.
• High-Density I/O and Compact Package: 704 I/O in a 2397-BBGA FCBGA package supports dense board designs while maintaining broad external connectivity.
• Configurable Power Envelope: Specified core supply from 770 mV to 970 mV supports design tuning between performance and power.
• Proven Family-Level Innovations: Features documented for the Stratix® 10 family, including Hyperflex architecture and advanced transceiver tiles, bring a coherent platform of performance and integration.

Why Choose 1SG280HU3F50I2VG?

The 1SG280HU3F50I2VG combines a very large logic element count, substantial on-chip memory, and broad I/O in a single industrial-grade package, making it well suited for high-bandwidth, compute-intensive designs that require field-programmable flexibility. Its inclusion in the Stratix® 10 GX family aligns it with architecture-level innovations such as the Hyperflex core and advanced transceiver and memory subsystems.

This device is aimed at system designers who need scalable FPGA capacity, high-speed serial interfaces, and industrial temperature performance for applications in networking, data center acceleration, telecommunications, and instrumentation—providing a balance of integration and performance for long-lived designs.

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