1SG280HU3F50I2LG

The 1SG280HU3F50I2LG is an Intel Stratix® 10 GX high-performance FPGA device built on the Stratix 10 family architecture. It leverages the family’s Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology to address advanced applications that require high bandwidth and substantial on-chip processing capacity.

This industrial-grade, surface-mount FPGA combines large logic capacity, extensive on-chip memory, and high-density I/O to support demanding networking, communications, and compute-oriented system designs while operating across an industrial temperature range.

Key Features

• Core architecture  Intel Hyperflex™ core architecture on 14 nm tri-gate (FinFET) process, designed for increased core performance as described for the Stratix 10 family.
• Logic capacity  2,800,000 logic elements (logic cells) to implement large-scale custom logic and complex designs.
• On-chip memory  240,123,904 total RAM bits and family support for M20K internal SRAM memory blocks for high-density storage and buffering on-chip.
• High-speed I/O and transceivers  704 user I/O pins and Stratix 10 family transceiver capabilities including up to 96 full-duplex transceiver channels and transceiver data rates up to 28.3 Gbps (family-level feature).
• Hard IP and protocol support  Family-level hard IP capabilities documented for PCI Express Gen1/Gen2/Gen3 and 10G/40G Ethernet with forward error correction (FEC) in transceiver channels.
• DSP and compute  Variable precision DSP blocks documented in the Stratix 10 family with high compute density (family-level performance figures provided in documentation).
• Power and supply  Core voltage supply range specified at 820 mV to 880 mV to meet device power requirements.
• Package and mounting  2397-BBGA (FCBGA) package; supplier device package specified as 2397-FBGA, FC (50×50). Surface-mount mounting type.
• Environmental and reliability  Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Typical Applications

• High-performance networking: Implement multi-gigabit linecards, backplane interfaces, and packet processing using high-speed transceivers and large logic capacity.
• Data-center acceleration: Offload compute-intensive workloads and custom acceleration functions leveraging the device’s large logic and DSP resources.
• Telecommunications systems: Implement protocol engines, forward error correction, and high-density PHY interfaces using family hard IP and transceiver features.
• High-bandwidth I/O aggregation: Aggregate and bridge between multiple high-speed links using abundant I/O and transceiver channels.

Unique Advantages

• High integration of logic and memory: 2.8M logic elements and 240,123,904 bits of on-chip RAM enable large, consolidated FPGA designs with reduced external memory dependence.
• Advanced high-speed serial capability: Stratix 10 family transceiver technology with multi-gigabit data rates supports demanding link and backplane requirements.
• Industrial temperature and RoHS compliance: Rated for −40 °C to 100 °C and RoHS compliant for deployment in industrial environments.
• Compact surface-mount BGA package: 2397-BBGA FCBGA (50×50) package provides high pin density for complex designs while remaining suitable for surface-mount assembly.
• Deterministic supply requirements: Specified core supply range (820 mV–880 mV) supports precise power planning in system designs.

Why Choose 1SG280HU3F50I2LG?

The 1SG280HU3F50I2LG delivers Stratix 10 GX family innovations—high logic density, extensive on-chip memory, and advanced transceiver capabilities—packaged for industrial applications. Its combination of large logic capacity, significant RAM resources, and high-density I/O makes it well suited for designers implementing high-throughput networking, compute acceleration, and protocol-intensive systems.

As an industrial-grade device in the Stratix 10 family, it offers a balance of performance and integration for projects requiring robust operating temperature range, precise supply characteristics, and large on-chip resources to minimize external component count and simplify system design.

Request a quote or submit an inquiry today to obtain pricing, availability, and technical ordering information for the 1SG280HU3F50I2LG.