1SG280HU3F50I3VG

The 1SG280HU3F50I3VG is an Intel Stratix® 10 GX field programmable gate array supplied in a 2397-ball FCBGA package. It delivers a high‑density fabric with 2,800,000 logic elements, 240,123,904 bits of embedded RAM, and 704 user I/O pins for demanding, compute‑ and I/O‑intensive designs.

Built on Stratix 10 family innovations such as the Intel Hyperflex core architecture and advanced 14 nm FinFET process, this device targets high‑performance communications, acceleration, and signal processing applications where compute density, large on‑chip memory, and wide I/O are required.

Key Features

• Core Logic  The device provides 2,800,000 logic elements (LEs) to implement large FPGA fabrics and complex algorithms.
• On‑Chip Memory  240,123,904 total RAM bits of embedded memory to support buffering, large lookup tables, and state storage on chip.
• I/O Density  704 user I/O pins to support high‑pin‑count interfaces and parallel connectivity in dense systems.
• Package & Mounting  2397‑ball BGA (FCBGA) package; supplier device package listed as 2397‑FBGA, FC (50×50). Surface mount construction for standard PCB assembly.
• Power Supply  Core voltage operating range of 770 mV to 970 mV, enabling integration with regulated power rails used in modern FPGA systems.
• Operating Temperature  Industrial operating range of −40 °C to 100 °C for deployment in temperature‑sensitive environments.
• Family-Level Innovations  Stratix 10 family features cited in the device overview include the Intel Hyperflex core architecture, 14 nm tri‑gate (FinFET) process, heterogeneous 3D SiP transceiver tiles, and advanced hard IP such as PCIe and high‑speed transceiver support.

Typical Applications

• High‑Performance Networking  Implements packet processing, line cards, and backplane interfaces using the device's high I/O count and Stratix 10 transceiver family capabilities.
• Data Center Acceleration  Supports compute‑intensive acceleration tasks and large on‑chip buffering with extensive logic resources and 240M+ bits of RAM.
• Telecommunications Infrastructure  Suited for baseband processing, fronthaul/backhaul interfaces, and protocol offload in equipment that requires high logic density and industrial temperature operation.
• Signal Processing & DSP  Enables implementation of complex DSP pipelines and highly parallel algorithms leveraging large logic fabric and embedded memory.

Unique Advantages

• High logic density: 2,800,000 logic elements provide the capacity to implement large designs and consolidate multiple functions into a single FPGA.
• Substantial on‑chip memory: 240,123,904 bits of RAM reduce external memory dependence and improve throughput for buffering and data‑intensive processing.
• Extensive I/O connectivity: 704 I/O pins accommodate wide parallel buses, multiple interfaces, and high‑pin‑count daughtercard connections.
• Industrial temperature range: −40 °C to 100 °C supports deployment in systems requiring extended thermal tolerance.
• Advanced packaging: 2397‑ball FCBGA (50×50) package enables dense routing and integration on high‑performance PCBs.
• Family‑level performance features: Access to Stratix 10 innovations such as the Hyperflex core architecture and heterogeneous transceiver tiles for designs that demand higher core performance and high‑speed connectivity.

Why Choose 1SG280HU3F50I3VG?

This Stratix 10 GX device combines very large logic capacity, extensive embedded RAM, and a high I/O count in a single surface‑mount FCBGA package—making it well suited for complex, I/O‑heavy systems that require significant on‑chip compute and memory resources. Its industrial temperature rating and defined core voltage range enable predictable integration into robust hardware platforms.

Designers targeting high‑bandwidth networking, data center acceleration, telecom infrastructure, and advanced signal processing can leverage the Stratix 10 family innovations referenced in the device overview to scale performance while retaining on‑chip integration and memory bandwidth.

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