1SG280LN2F43E2VGS3

The 1SG280LN2F43E2VGS3 is a Stratix® 10 GX field programmable gate array (FPGA) in a 1760‑BBGA FCBGA package. It implements high-capacity programmable logic and on-chip memory intended for demanding bandwidth and processing tasks in communications, data center, and signal processing designs.

Built on the Stratix® 10 GX device family architecture, this part delivers a high logic element count, large embedded RAM, and extensive I/O capability while operating from a core supply range of 770 mV to 970 mV and an extended temperature grade of 0°C to 100°C.

Key Features

• High Logic Capacity  2,800,000 logic elements provide substantial programmable fabric for complex custom logic, state machines, and data-path implementations.
• Large Embedded Memory  240,123,904 total RAM bits enable substantial on-chip buffering, lookup tables, and memory-based algorithms without external memory for many use cases.
• Extensive I/O  688 user I/O pins support wide parallel interfaces, multi-lane connectivity, and diverse board-level signaling.
• Family-Level Architecture  Part of the Stratix® 10 GX series, which includes the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology as series innovations.
• Package and Mounting  1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑FBGA (42.5 × 42.5 mm). Surface mount for standard PCB assembly.
• Power and Thermal  Core supply range 770 mV to 970 mV with an operating temperature range of 0°C to 100°C; device grade is Extended.
• Standards Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking  Implements protocol acceleration, packet processing, and multi‑lane PHY interfaces using the device's large logic capacity and abundant I/O.
• Data Center Acceleration  Suitable for hardware acceleration functions and custom compute kernels that require significant on‑chip memory and programmable fabric.
• High‑Speed Backplane and Module Interfaces  Supports board‑level and backplane signaling designs that need many I/O lines and substantial logic resources.
• Signal Processing and DSP  Large RAM and logic element resources enable implementation of complex filtering, channelization, and fixed/floating point data paths.

Unique Advantages

• Large On‑Chip Capacity:  2.8 million logic elements and 240 million bits of RAM reduce dependence on external logic and memory, simplifying system BOM and layout.
• Broad I/O Matrix:  688 I/O pins allow flexible interfacing to wide parallel buses, high‑speed I/O lanes, and multiple peripheral sets on a single device.
• Series Innovation Access:  As a Stratix® 10 GX family device, designs can leverage family-level features such as the Hyperflex™ core architecture and FinFET process innovations where applicable.
• Compact, Serviceable Packaging:  1760‑pin BBGA in a 42.5 × 42.5 mm footprint provides high density routing in a surface‑mount form factor for modern PCB designs.
• Production and Environmental Readiness:  RoHS compliance and an extended operating grade (0°C to 100°C) support a wide range of commercial and industrial deployments.

Why Choose 1SG280LN2F43E2VGS3?

This Stratix® 10 GX FPGA part combines very high programmable logic density, large on‑chip RAM, and extensive I/O to address demanding bandwidth and compute tasks on a single device. Its package and electrical characteristics make it suitable for designers who need to consolidate functionality while maintaining board‑level routing efficiency.

Engineers building high‑performance networking, data center acceleration, or signal processing systems can use this device to scale custom hardware functions with the long‑term support of the Stratix® 10 device family and its documented architectural features.

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