1SG280LN2F43I1VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 255 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280LN2F43I1VGAS – Stratix® 10 GX FPGA, 2,800,000 logic elements, 688 I/O, 1760‑BBGA
The 1SG280LN2F43I1VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760‑BBGA FCBGA package. It delivers a high-capacity programmable fabric with 2,800,000 logic elements and extensive on-chip memory for demanding digital designs.
Built for industrial applications that require large I/O counts and significant embedded memory, this device supports low-voltage core supply operation and a wide operating temperature range for robust deployment.
Key Features
- Core Capacity 2,800,000 logic elements provide a large programmable fabric suitable for complex logic and high-density integration.
- Embedded Memory 240,123,904 total RAM bits for large buffers, packet storage, and on-chip data processing.
- I/O Resources 688 user I/O pins to support wide parallel interfaces, multiple transceivers, or high-channel-count designs.
- Package 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) FCBGA package for surface-mount applications requiring a high I/O count and dense routing.
- Power Supply Core voltage supply range of 770 mV to 970 mV for compatibility with modern low-voltage system rails.
- Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C, suited for harsh environments.
- Mounting Surface mount package designed for standard PCB assembly processes.
- Standards & Compliance RoHS compliant for environmental and manufacturing requirements.
- Family Innovations Part of the Intel Stratix 10 GX family featuring the Intel Hyperflex core architecture and 14 nm FinFET process technology (family-level attributes documented in the device overview).
Typical Applications
- High‑performance Networking Use the large logic fabric and extensive I/O to implement packet processing, switching fabrics, and protocol offload engines.
- Telecommunications & Optical Transport Leverage on‑chip memory and high I/O counts for channel aggregation, framing, and buffering in transport systems.
- Data Center Acceleration Deploy in accelerator or custom compute modules where large logic capacity and memory support application-specific datapaths.
- Industrial Control & Instrumentation Industrial-grade temperature rating and robust I/O make the device suitable for control systems, test equipment, and automated instrumentation.
Unique Advantages
- High Logic Density: 2.8 million logic elements enable integration of complex functions that reduce external components and board-level complexity.
- Substantial On‑Chip Memory: 240 million+ RAM bits allow large buffers and stateful processing without relying on external memory for many use cases.
- Large I/O Count: 688 I/Os provide flexibility for wide parallel interfaces, multiple serial/transceiver channels, or mixed signal neighborhoods.
- Industrial Reliability: −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
- Compact, High‑Pin Package: 1760‑FBGA (42.5 × 42.5 mm) package delivers dense routing and high pin-count in a surface-mount form factor.
- Low‑Voltage Core Operation: 770 mV–970 mV supply range aligns with modern low-power system architectures.
Why Choose 1SG280LN2F43I1VGAS?
This Stratix® 10 GX device combines very large programmable capacity, extensive embedded RAM, and a high I/O count in a robust industrial-grade package. It is positioned for engineers developing complex, high-throughput systems who need a single FPGA that consolidates logic, memory, and interface requirements.
Choosing this part offers scalability within the Stratix 10 GX family and the ability to deploy in temperature‑sensitive or industrial environments while maintaining low-voltage core compatibility and RoHS compliance.
Request a quote or submit an availability and pricing request to evaluate 1SG280LN2F43I1VGAS for your next high-performance FPGA design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018