1SG280LN3F43E2LGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,031 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280LN3F43E2LGAS – Stratix® 10 GX Field Programmable Gate Array (FPGA)
The 1SG280LN3F43E2LGAS is an Intel Stratix® 10 GX high-performance FPGA in a 1760-BBGA (FCBGA) package. Built around the Intel Hyperflex™ core architecture and optimized for demanding bandwidth and compute tasks, this device targets high-performance networking, communications, and data-accelerated systems.
With 2,800,000 logic elements, extensive on-chip RAM and a large I/O complement, the part delivers dense programmability and system integration for applications that require deep logic capacity, high I/O counts, and advanced family-level capabilities described in the Stratix 10 GX series.
Key Features
- Core Architecture Intel Hyperflex™ core architecture as featured in the Stratix 10 GX family, delivering enhanced core performance for complex logic and DSP workloads.
- Logic Density 2,800,000 logic elements for large-scale programmable logic integration and implementation of complex algorithms.
- On-Chip Memory 240,123,904 total RAM bits to support deep buffering, on-chip data storage, and memory-intensive designs.
- I/O Capacity 688 I/O pins to support high-density interfaces and broad connectivity across system peripherals and high-speed links.
- Voltage and Power Core voltage supply range: 820 mV to 880 mV, enabling designs that require the specified low-voltage core rails.
- Package & Mounting 1760-BBGA (FCBGA) package; supplier device package 1760-FBGA (42.5 × 42.5 mm); surface-mount mounting for PCB assembly.
- Extended Grade & Temperature Extended grade device with an operating temperature range of 0 °C to 100 °C to meet a wide set of application environments.
- Family-Level Innovations Stratix 10 GX family features noted in the device overview include Intel 14 nm tri-gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, high‑performance DSP blocks, and hard IP options available within the family.
- Compliance RoHS compliant for environmental and regulatory requirements.
Typical Applications
- Telecommunications & Networking High-density I/O and large logic and memory resources enable packet processing, line-rate switching, and custom protocol implementations.
- Data Center Acceleration On-chip RAM and abundant logic elements support hardware acceleration for data processing, compression, and encryption functions.
- High-Performance Computing Dense programmable fabric and family-level DSP capabilities are suited to signal processing and compute-intensive workloads.
- Test & Measurement High I/O count and flexible logic capacity enable complex data acquisition, real-time analysis, and custom instrument control.
Unique Advantages
- High Logic Capacity: 2,800,000 logic elements provide room for large, integrated designs and reduce the need for multiple devices.
- Large On-Chip Memory: 240,123,904 total RAM bits reduce external memory dependence and improve latency for buffering and streaming applications.
- Extensive I/O: 688 I/O pins enable broad peripheral connectivity and support for multi-channel interfaces without external multiplexing.
- Compact, Production-Ready Package: 1760-FBGA (42.5 × 42.5 mm) surface-mount package facilitates dense board layouts and standard assembly processes.
- Designed for High-Performance Systems: Built on Stratix 10 GX family innovations—such as Hyperflex architecture and FinFET technology—to address demanding bandwidth and compute requirements.
- Regulatory Compliance: RoHS compliance supports environmental and corporate sustainability goals.
Why Choose 1SG280LN3F43E2LGAS?
The 1SG280LN3F43E2LGAS positions itself as a high-capacity, high-integration FPGA solution for designs that require significant logic, on-chip memory, and extensive I/O in a single device. Its Stratix 10 GX family heritage delivers architectural innovations that support demanding processing and bandwidth needs while providing the package and electrical characteristics required for complex system integration.
This device is well suited for engineering teams building advanced networking, data center acceleration, and high-performance signal-processing systems who need a scalable, robust FPGA platform with clear family-level advantages and verified environmental compliance.
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