1SG280LN3F43E3XGS3

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA

Quantity 897 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280LN3F43E3XGS3 – Stratix® 10 GX Field Programmable Gate Array, 1760-BBGA

The 1SG280LN3F43E3XGS3 is an Intel Stratix® 10 GX FPGA in a 1760-ball FCBGA package, designed for high-density, high-throughput programmable logic applications. This device delivers large on-chip resources—millions of logic elements and hundreds of megabits of RAM—targeting advanced networking, compute acceleration, and high-speed I/O systems.

As part of the Stratix 10 GX family, the device benefits from series-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate technology, providing enhanced core performance and system-level IP to address demanding bandwidth and processing requirements.

Key Features

  • Logic Capacity  2,800,000 logic elements (LEs) to implement large-scale custom logic and complex algorithms directly in the FPGA fabric.
  • On‑Chip Memory  240,123,904 total RAM bits of embedded memory for high-bandwidth buffering, lookup tables, and state storage.
  • I/O Density & Package  688 I/O pins in a 1760-ball BGA (42.5 × 42.5 mm supplier package) surface-mount package to support extensive external interfacing and dense board layouts.
  • Series Architecture  Stratix 10 family-level innovations including the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process that target increased core performance and efficiency.
  • High‑Speed Connectivity (Series-Level)  Family documentation highlights heterogeneous 3D SiP transceiver tiles, multi-gigabit transceiver capabilities, and hard IP such as PCI Express Gen3 and 10G Ethernet features for high-bandwidth system designs.
  • Power and Supply  Specified core voltage range of 820 mV to 880 mV to align with the device's high-performance fabric and power delivery requirements.
  • Operating Range & Grade  Extended grade device specified for operation from 0 °C to 100 °C; RoHS compliant.

Typical Applications

  • Data Center & Networking  High logic density and extensive I/O support packet processing, switching, and line-rate acceleration in networking equipment and data center appliances.
  • Compute Acceleration  Large FPGA fabric and abundant on-chip RAM make the device suitable for FPGA-based accelerators and custom compute engines that offload intensive algorithms.
  • Telecom & Carrier Infrastructure  Series-level transceiver and hard-IP capabilities support high-bandwidth transport, protocol offload, and forward error correction in telecom line cards and equipment.
  • Test, Measurement & Broadcast  High I/O count and memory capacity enable complex signal processing, real-time data handling, and multi-channel interfacing for test instrumentation and broadcast systems.

Unique Advantages

  • High Logic Density:  2.8 million logic elements allow implementation of large, integrated designs that reduce the need for external ASICs or multiple FPGAs.
  • Substantial On‑Chip RAM:  240 Mbit+ of embedded RAM provides fast, local storage for buffering, look-up tables, and state machines—reducing latency and external memory traffic.
  • Robust I/O & Packaging:  688 I/Os in a compact 1760-FBGA package enable dense board integration and flexible interfacing options for complex systems.
  • Family-Level Performance Innovations:  Access to Stratix 10 series features such as Hyperflex architecture and high-speed transceiver tiles supports designs demanding throughput and deterministic performance.
  • Extended Temperature Grade:  0 °C to 100 °C operating range accommodates extended-temperature commercial applications without implying industrial or automotive qualifications.
  • Regulatory Compliance:  RoHS compliant to support modern manufacturing and environmental requirements.

Why Choose 1SG280LN3F43E3XGS3?

The 1SG280LN3F43E3XGS3 is positioned for engineers who need a high-capacity programmable fabric with substantial on-chip memory and extensive I/O in a compact BGA package. Its inclusion in the Stratix 10 GX family brings series-level architectural benefits—Hyperflex core innovations and high-speed connectivity options—that help accelerate development of high-throughput, compute‑intensive solutions.

This device is suited to teams building networking, data center, telecom, and compute-acceleration products that require scalable logic resources, large embedded RAM, and dense external interfacing, delivering long-term design headroom within the Stratix 10 ecosystem.

Request a quote or submit an inquiry for 1SG280LN3F43E3XGS3 to check pricing and availability for your next high-performance FPGA design.

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