1SG280LN3F43E3XGS3
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 897 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280LN3F43E3XGS3 – Stratix® 10 GX Field Programmable Gate Array, 1760-BBGA
The 1SG280LN3F43E3XGS3 is an Intel Stratix® 10 GX FPGA in a 1760-ball FCBGA package, designed for high-density, high-throughput programmable logic applications. This device delivers large on-chip resources—millions of logic elements and hundreds of megabits of RAM—targeting advanced networking, compute acceleration, and high-speed I/O systems.
As part of the Stratix 10 GX family, the device benefits from series-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate technology, providing enhanced core performance and system-level IP to address demanding bandwidth and processing requirements.
Key Features
- Logic Capacity 2,800,000 logic elements (LEs) to implement large-scale custom logic and complex algorithms directly in the FPGA fabric.
- On‑Chip Memory 240,123,904 total RAM bits of embedded memory for high-bandwidth buffering, lookup tables, and state storage.
- I/O Density & Package 688 I/O pins in a 1760-ball BGA (42.5 × 42.5 mm supplier package) surface-mount package to support extensive external interfacing and dense board layouts.
- Series Architecture Stratix 10 family-level innovations including the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process that target increased core performance and efficiency.
- High‑Speed Connectivity (Series-Level) Family documentation highlights heterogeneous 3D SiP transceiver tiles, multi-gigabit transceiver capabilities, and hard IP such as PCI Express Gen3 and 10G Ethernet features for high-bandwidth system designs.
- Power and Supply Specified core voltage range of 820 mV to 880 mV to align with the device's high-performance fabric and power delivery requirements.
- Operating Range & Grade Extended grade device specified for operation from 0 °C to 100 °C; RoHS compliant.
Typical Applications
- Data Center & Networking High logic density and extensive I/O support packet processing, switching, and line-rate acceleration in networking equipment and data center appliances.
- Compute Acceleration Large FPGA fabric and abundant on-chip RAM make the device suitable for FPGA-based accelerators and custom compute engines that offload intensive algorithms.
- Telecom & Carrier Infrastructure Series-level transceiver and hard-IP capabilities support high-bandwidth transport, protocol offload, and forward error correction in telecom line cards and equipment.
- Test, Measurement & Broadcast High I/O count and memory capacity enable complex signal processing, real-time data handling, and multi-channel interfacing for test instrumentation and broadcast systems.
Unique Advantages
- High Logic Density: 2.8 million logic elements allow implementation of large, integrated designs that reduce the need for external ASICs or multiple FPGAs.
- Substantial On‑Chip RAM: 240 Mbit+ of embedded RAM provides fast, local storage for buffering, look-up tables, and state machines—reducing latency and external memory traffic.
- Robust I/O & Packaging: 688 I/Os in a compact 1760-FBGA package enable dense board integration and flexible interfacing options for complex systems.
- Family-Level Performance Innovations: Access to Stratix 10 series features such as Hyperflex architecture and high-speed transceiver tiles supports designs demanding throughput and deterministic performance.
- Extended Temperature Grade: 0 °C to 100 °C operating range accommodates extended-temperature commercial applications without implying industrial or automotive qualifications.
- Regulatory Compliance: RoHS compliant to support modern manufacturing and environmental requirements.
Why Choose 1SG280LN3F43E3XGS3?
The 1SG280LN3F43E3XGS3 is positioned for engineers who need a high-capacity programmable fabric with substantial on-chip memory and extensive I/O in a compact BGA package. Its inclusion in the Stratix 10 GX family brings series-level architectural benefits—Hyperflex core innovations and high-speed connectivity options—that help accelerate development of high-throughput, compute‑intensive solutions.
This device is suited to teams building networking, data center, telecom, and compute-acceleration products that require scalable logic resources, large embedded RAM, and dense external interfacing, delivering long-term design headroom within the Stratix 10 ecosystem.
Request a quote or submit an inquiry for 1SG280LN3F43E3XGS3 to check pricing and availability for your next high-performance FPGA design.

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