1SG280LN3F43I1VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 30 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280LN3F43I1VGAS – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC, 688 I/O, 2,800,000 logic elements, 1760-BBGA (42.5×42.5)
The Intel Stratix® 10 GX 1SG280LN3F43I1VGAS is a high-capacity, high-performance FPGA built on the Stratix 10 GX family architecture. It leverages Intel’s Hyperflex core architecture and 14 nm FinFET technology to address demanding bandwidth and processing applications in communications, data center, and advanced embedded systems.
With 2,800,000 logic elements, extensive embedded memory, and high-speed transceiver support at the device family level, this device targets designs that require dense programmable logic, large on-chip memory, and robust I/O connectivity while operating across an industrial temperature range.
Key Features
- Core Architecture Intel Hyperflex™ core architecture and 14 nm FinFET process as described for the Stratix 10 family, delivering improved core performance for compute-intensive logic.
- Logic Capacity 2,800,000 logic elements to implement large-scale programmable logic designs.
- Embedded Memory 240,123,904 total RAM bits of on-chip memory, with M20K SRAM block architecture referenced in the Stratix 10 family overview.
- High‑Speed Transceivers (Series-Level) Stratix 10 family transceiver innovations include heterogeneous 3D SiP transceiver tiles and transceiver data rates listed up to 28.3 Gbps, supporting high-bandwidth serial links and backplane interfaces.
- Hard IP and DSP (Series-Level) Series-level features include hard PCI Express Gen3, hard 10G Ethernet, Interlaken PCS hard IP, and variable-precision DSP blocks (family-level DSP performance information included in the device overview).
- Package & I/O 1760-BBGA FCBGA package; supplier device package 1760-FBGA with 42.5×42.5 mm dimensions and 688 user I/Os for dense system integration. Surface-mount device.
- Power Supply Core voltage supply range specified at 770 mV to 970 mV.
- Operating Range & Grade Industrial-grade device with an operating temperature range of −40°C to 100°C and RoHS compliance.
- Configuration, Security & System Features (Series-Level) Stratix 10 family documentation references Secure Device Manager (SDM), device security, partial and dynamic reconfiguration, and power management features.
Typical Applications
- High‑Performance Networking Implements packet processing, PHY bridging, and high-speed backplane interfaces using the device family’s transceiver and hard IP capabilities.
- Data Center Acceleration Supports custom hardware acceleration and large logic/ memory implementations for compute and I/O offload tasks.
- Telecommunications Equipment Enables high-bandwidth link aggregation, line cards, and protocol processing leveraging dense logic and high-speed serial connectivity.
- Advanced Embedded Systems Suitable for embedded compute platforms that require large FPGA fabric, plentiful on-chip memory, and industrial temperature operation.
Unique Advantages
- High Logic Density: 2,800,000 logic elements provide the capacity to implement complex, large-scale designs on a single device, reducing system-level part count.
- Substantial On‑Chip Memory: 240,123,904 total RAM bits support large buffers, on-chip data caches, and memory-intensive algorithms without immediate reliance on external memory.
- Robust I/O and Packaging: 688 user I/Os in a 1760-BBGA (42.5×42.5 mm) surface-mount package enable dense connectivity and compact board layouts for space-constrained systems.
- Industrial Operating Range: −40°C to 100°C rating and surface-mount packaging make the device suitable for industrial environments requiring extended temperature operation.
- Power Supply Flexibility: Core operation across a 770 mV to 970 mV supply range permits design optimization for power and performance trade-offs.
- Series-Level Performance & Integration: Stratix 10 family features—such as Hyperflex architecture, advanced transceiver tiles, hard IP blocks, and DSP capabilities—support higher throughput and system-level integration.
Why Choose 1SG280LN3F43I1VGAS?
The 1SG280LN3F43I1VGAS packs large-scale programmable logic, extensive on-chip memory, and dense I/O into a single industrial-grade Stratix 10 GX device. It is positioned for engineers building bandwidth- and compute-intensive systems that benefit from the Stratix 10 family’s core architecture and series-level hard IP and transceiver features.
This device delivers long-term design value through high integration and broad family capabilities, enabling scalable designs and access to the Stratix 10 device ecosystem and documentation for advanced configuration, security, and power management options.
Request a quote or submit an inquiry to receive current pricing, availability, and lead-time information for 1SG280LN3F43I1VGAS.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018