1SG280LN3F43I2VGAS

The 1SG280LN3F43I2VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) packaged in a 1760‑BBGA FCBGA (42.5 × 42.5 mm) with surface‑mount capability and an industrial temperature grade. It combines the Stratix 10 family architecture innovations with high logic density and large embedded memory to address demanding, bandwidth‑ and compute‑intensive designs.

Engineered for applications that require significant on‑chip logic, memory capacity and extensive I/O, this device delivers the performance and integration expected from the Stratix 10 GX family while operating across a 770 mV to 970 mV core supply range and an operating temperature window from −40 °C to 100 °C.

Key Features

• Core architecture  Built on the Intel Stratix 10 GX family architecture with the Intel Hyperflex™ core innovations described for Stratix 10 devices, delivering improved core performance for demanding logic designs.
• Logic capacity  2,800,000 logic elements, providing high fabric density for complex FPGA implementations.
• On‑chip memory  240,123,904 total RAM bits of embedded memory to support large buffering, packet processing, and data‑centric workloads.
• I/O and transceivers  688 I/O pins available for flexible system interfacing; the Stratix 10 family also documents support for high‑speed transceiver channels and backplane performance at the device family level.
• Power and supply  Core supply operating range from 770 mV to 970 mV to match system power design requirements.
• Package and mounting  1760‑BBGA FCBGA package (supplier device package: 1760‑FBGA, 42.5 × 42.5 mm) designed for surface‑mount assembly.
• Temperature and grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Standards and compliance  RoHS‑compliant construction for regulatory and environmental considerations.

Typical Applications

• High‑performance networking  Protocol processing, packet inspection and line‑rate functions that leverage large logic capacity and abundant I/O.
• Data center acceleration  Hardware acceleration and inline processing where on‑chip memory and dense logic reduce latency and system overhead.
• Backplane and high‑speed serial systems  Systems requiring extensive I/O and family‑documented high‑speed transceiver performance for chip‑to‑chip and backplane links.
• Signal processing and DSP  Compute‑intensive signal and data path implementations that benefit from the Stratix 10 family’s variable precision DSP capabilities and large embedded memory.

Unique Advantages

• High logic density: 2.8 million logic elements enable integration of large, complex designs on a single device, reducing board count and system complexity.
• Substantial embedded memory: Over 240 million bits of on‑chip RAM provide the capacity needed for deep buffers, tables and on‑device data storage.
• Extensive I/O resources: 688 I/O pins allow flexible interfacing to peripherals, memory, and high‑speed serial links, simplifying system routing and partitioning.
• Industrial thermal range: Rated for −40 °C to 100 °C operation, supporting deployment in a wide range of industrial environments.
• Compact high‑pin package: The 1760‑BBGA FCBGA (42.5 × 42.5 mm) balances high pin count with a compact PCB footprint for dense system designs.
• Compliant and manufacturable: Surface‑mount, RoHS‑compliant construction aligns with common manufacturing and regulatory requirements.

Why Choose 1SG280LN3F43I2VGAS?

This Stratix 10 GX FPGA part number delivers a combination of high logic capacity, large embedded RAM, and extensive I/O in an industrial‑grade, surface‑mount BBGA package. It is suitable for design teams targeting advanced networking, high‑performance compute acceleration, and high‑speed I/O applications that require significant on‑chip resources while maintaining robustness across a wide temperature range.

Choosing 1SG280LN3F43I2VGAS provides scalability and integration that can reduce system BOM and simplify board‑level partitioning, backed by the Stratix 10 family architecture and documented device‑family capabilities.

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