1SG280LN3F43I3XP
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 473 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280LN3F43I3XP – Stratix® 10 GX FPGA IC, 688 I/O, 2,800,000 logic elements, 1760‑BBGA
The 1SG280LN3F43I3XP is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) packaged in a 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) surface‑mount package. Built on the Stratix 10 family architecture, it combines a high logic capacity with large embedded RAM and extensive I/O to address demanding, high‑bandwidth system designs.
Targeted at industrial applications, this device pairs the Intel Hyperflex™ core family innovations and advanced transceiver and hard IP capabilities described for the Stratix 10 GX series with device‑level specifications including 2,800,000 logic elements, 240,123,904 total RAM bits, and 688 I/O pins.
Key Features
- Core Architecture Intel Stratix 10 family innovations including the Intel Hyperflex™ core architecture as described in the device overview, delivering significant core performance improvements versus previous high‑performance FPGA generations.
- Logic Capacity 2,800,000 logic elements for large, complex hardware implementations and high‑density logic integration.
- Embedded Memory 240,123,904 total RAM bits to support large buffering, lookup tables, and on‑chip data storage.
- I/O and Connectivity 688 I/O pins providing extensive external interface options for high‑pin‑count systems and modules.
- Power and Supply Core voltage supply range specified at 820 mV to 880 mV for the device core domain.
- Package and Mounting 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) surface‑mount package optimized for dense board routing and thermal management.
- Temperature and Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C.
- Standards and Compliance RoHS compliant for environmental and regulatory adherence.
Typical Applications
- High‑performance networking and switching — Large logic capacity and extensive I/O support wideband packet processing, protocol engines, and programmable switch fabrics.
- Data center acceleration — On‑chip RAM and high logic density enable custom accelerators, packet inspection, and compute offload tasks.
- High‑speed serial and communications modules — The Stratix 10 family transceiver and hard IP capabilities described in the device overview suit backplane, module, and chip‑to‑chip connectivity needs.
- Signal processing and DSP — Large embedded memory and logic resources support complex DSP pipelines and fixed/floating‑point implementations described in the family overview.
Unique Advantages
- Large logic and memory footprint: 2,800,000 logic elements and 240,123,904 RAM bits enable dense, feature‑rich hardware designs without relying on external FPGA fabric.
- Extensive I/O availability: 688 I/O pins provide flexibility for multi‑lane interfaces, parallel buses, and mixed‑signal front‑ends.
- Industrial temperature range: Rated for −40 °C to 100 °C, suitable for systems requiring extended ambient operation.
- Advanced Stratix 10 family innovations: Leverages Hyperflex core architecture and other family features to deliver higher core performance and integration benefits noted in the device overview.
- Package optimized for high‑density designs: 1760‑FBGA package footprint supports complex PCB routing and thermal considerations in compact layouts.
- Regulatory compliance: RoHS compliant for streamlined product compliance and assembly processes.
Why Choose 1SG280LN3F43I3XP?
The 1SG280LN3F43I3XP positions itself for demanding industrial and high‑bandwidth applications that require a combination of very high logic capacity, substantial on‑chip memory, and broad I/O. Its Stratix 10 family heritage brings architectural improvements designed to increase core performance while supporting advanced transceiver and hard IP capabilities described in the device overview.
This device is well suited for system designers and engineers building complex, scalable hardware accelerators, networking equipment, and high‑speed communications modules who need a high‑density FPGA with industrial temperature capability and a package footprint compatible with dense board designs.
Request a quote or submit your design requirements to receive pricing and availability information for the 1SG280LN3F43I3XP.

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