1SG280LU2F50I2LGAS

The 1SG280LU2F50I2LGAS is an Intel Stratix® 10 GX family FPGA offering high logic density and large on-chip RAM in a 2397-BBGA (FCBGA) package. It combines the Stratix 10 family innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate technology with device-level attributes targeted at demanding industrial applications.

This device is suited for advanced designs that require extensive logic resources, significant embedded memory, and a high count of I/O while operating across an industrial temperature range.

Key Features

• Logic Capacity — 2,800,000 logic elements (LEs) for large-scale, complex logic implementation.
• Embedded Memory — 240,123,904 total RAM bits to support large on-chip buffering, state machines, and data structures.
• I/O Resources — 704 I/O pins to accommodate dense external interfacing and multi-channel connectivity.
• Core Architecture — Built on the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to deliver the family-level performance and efficiency characteristics described for Stratix 10 GX devices.
• Package and Mounting — 2397-BBGA (FCBGA) supplier device package (2397‑FBGA, FC 50×50) in a surface-mount form factor for system integration.
• Power Supply — Core voltage supply range of 820 mV to 880 mV for the device core.
• Operating Temperature — Industrial-grade operation from −40°C to 100°C for use in temperature-challenging environments.
• Standards and Compliance — RoHS compliant.

Typical Applications

• High-bandwidth Networking and Switching — Implement packet processing, MAC/PHY offload, and complex forwarding logic using large logic capacity and substantial embedded RAM.
• Data Center Acceleration — Offload compute-intensive tasks and accelerate custom algorithms where high logic density and wide I/O are required.
• Telecommunications and Packet Processing — Support for advanced telecom systems that demand extensive on-chip memory and many external interfaces.
• High-speed Serial I/O Systems — Integrate into systems needing numerous I/O channels and complex protocol handling at the FPGA fabric level.

Unique Advantages

• Exceptional Logic Density: 2.8 million logic elements enable implementation of large, multi-function designs without partitioning across multiple devices.
• Substantial On-Chip Memory: Over 240 million bits of RAM reduce external memory dependence and improve latency for buffering and stateful processing.
• Extensive I/O Count: 704 I/O pins provide flexibility for multi-channel interfaces, parallel buses, and mixed-signal front ends.
• Industrial Temperature Range: Rated from −40°C to 100°C for deployment in harsh or temperature-variable installations.
• Advanced Core Technology: Stratix 10 family innovations, including the Intel Hyperflex architecture and 14 nm tri-gate process, contribute to the device’s performance and efficiency profile.
• Compact Surface-Mount Package: 2397-BBGA (FCBGA) package provides a high-pin-count solution in a space-efficient footprint.

Why Choose 1SG280LU2F50I2LGAS?

The 1SG280LU2F50I2LGAS positions itself where high logic capacity, large embedded RAM, and broad I/O converge in an industrial-grade Stratix 10 GX device. It is appropriate for system designers needing to consolidate complex functions into a single FPGA—reducing board-level complexity while retaining headroom for future feature growth.

As a member of the Stratix 10 family from Intel, this device leverages the family-level architectural advances to provide a scalable platform for advanced networking, compute acceleration, and communications designs that require long-term robustness and performance.

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