1SG280LU3F50E3XG

The 1SG280LU3F50E3XG is a Stratix® 10 GX Field Programmable Gate Array in a 2397‑ball FCBGA package. It delivers high logic capacity and large on‑chip memory for advanced programmable designs requiring substantial logic and I/O resources.

Built on Intel's Stratix 10 family architecture, the device incorporates Intel Hyperflex core innovations and 14 nm tri‑gate (FinFET) technology noted in the Stratix 10 device overview, making it suitable for high‑density, performance‑focused FPGA implementations across communications, compute acceleration, and advanced prototyping.

Key Features

• Core Architecture  Based on the Intel Stratix 10 family with the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology as described in the Stratix 10 device overview.
• Logic Capacity  2,800,000 logic elements providing substantial programmable logic resources for complex designs.
• Configurable Logic Blocks  350,000 CLBs documented for the device, supporting large-scale logic partitioning and implementation.
• On‑chip Memory  240,123,904 total RAM bits for large local storage, buffering, and memory‑intensive logic functions.
• I/O Density  704 available I/O pins to interface with high‑channel peripheral and high‑bandwidth system requirements.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV.
• Package & Mounting  2397‑BBGA (FCBGA) supplier device package / 2397‑FBGA, FC (50×50) in a surface‑mount format for high‑density board designs.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑density custom logic and prototyping  Use the large logic element count and extensive CLBs to implement complex, programmable hardware prototypes and custom accelerators.
• Data plane and network processing  High I/O count combined with large on‑chip RAM makes the device suitable for designs that require many external interfaces and packet buffering.
• Compute acceleration  Large logic and memory resources enable implementation of hardware accelerators and data‑path functions where on‑chip resources reduce external memory dependence.
• High‑channel interface aggregation  704 I/O pins support multi‑lane interfaces and broad peripheral connectivity in communication or test systems.

Unique Advantages

• High logic density: 2,800,000 logic elements provide headroom for large, complex designs and multi‑function integration.
• Substantial on‑chip memory: 240,123,904 total RAM bits reduce reliance on external memory for buffering and state storage.
• Extensive I/O capability: 704 I/Os enable broad connectivity and support for multi‑channel systems without extensive external glue logic.
• Compact, surface‑mount FCBGA package: 2397‑BBGA/FCBGA package offers a high‑pin‑count, board‑level footprint suitable for dense system designs.
• Extended temperature grade: Rated for 0 °C to 100 °C operation to match applications that require a wider commercial temperature range.
• Standards‑aware manufacturing: RoHS compliance supports integration into compliant production flows.

Why Choose 1SG280LU3F50E3XG?

The 1SG280LU3F50E3XG positions itself as a high‑capacity Stratix 10 GX FPGA option for designs that demand significant programmable logic, large embedded memory, and a high number of I/O channels in a compact FCBGA package. Its extended temperature rating and RoHS compliance make it suitable for a range of commercial and enterprise applications.

Engineers targeting complex custom logic, network/data‑plane processing, or compute acceleration will find the combination of logic density, memory, and I/O resources beneficial for reducing external components and simplifying board design while leveraging the Stratix 10 family architecture.

Request a quote or submit an inquiry to get pricing and availability information for the 1SG280LU3F50E3XG and to discuss how it can meet your project requirements.