1SG280LU3F50E3XGS3

The 1SG280LU3F50E3XGS3 is a Stratix® 10 GX FPGA in a 2397-BBGA FCBGA package. It combines a high logic capacity FPGA fabric with large on-chip RAM and extensive I/O to address demanding bandwidth and processing applications.

Built on the Intel Stratix 10 family architecture, the device leverages the Hyperflex core approach and Intel 14 nm tri-gate (FinFET) technology to deliver significant core performance and power efficiency improvements for networking, compute acceleration, and high-performance embedded systems.

Key Features

• Core and Architecture Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology enable the Stratix 10 family performance characteristics described in the device overview.
• Logic Capacity 2,800,000 logic elements provide large programmable fabric for complex algorithms and high-density implementations.
• On‑Chip Memory 240,123,904 total RAM bits of embedded memory to support buffering, packet processing, and large working datasets; family includes M20K internal SRAM memory block architecture.
• I/O and Transceivers 704 user I/Os in the package to support wide external connectivity. The Stratix 10 family supports high-speed transceiver capabilities, including multi-gigabit channels and backplane/module data rates described in the device overview.
• Hard IP and DSP Family-level hard IP features include PCI Express Gen3 and 10G/40G Ethernet support and variable-precision DSP blocks for compute-intensive signal processing (as detailed in the device overview).
• Power and Voltage Core voltage supply range from 820 mV to 880 mV for the device core domain as specified.
• Package and Mounting 2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC 50×50) with surface-mount mounting type for board-level integration.
• Operating Range and Compliance Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.

Typical Applications

• Data Center Networking Packet processing, switch and router line cards, and high-bandwidth transport functions that require large logic fabric and on-chip memory.
• Telecommunications Backplane and Transport Backplane modules and line interfaces utilizing high-speed transceivers and hard Ethernet/forward error correction IP available in the Stratix 10 family.
• Compute Acceleration and DSP Signal processing, FPGA-based accelerators, and algorithm offload where large DSP resources and memory are needed for throughput and low-latency processing.
• PCI Express-Based Systems Accelerator cards and host-attached devices leveraging family-level PCI Express Gen3 hard IP and high fabric density.

Unique Advantages

• High Logic Density: 2.8 million logic elements enable implementation of complex, high-capacity designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: 240,123,904 bits of embedded RAM reduce dependence on external memory for buffering and datasets, improving throughput and latency.
• Extensive I/O Count: 704 I/Os in a compact FCBGA package allow flexible board-level connectivity for parallel interfaces and wide buses.
• Advanced Family-Level Capabilities: Hyperflex core architecture, FinFET process technology, and family hard IP (PCIe, Ethernet, DSP) provide a platform suited to bandwidth- and compute-intensive designs as described in the device overview.
• Compact, Surface-Mount Package: 2397-BBGA FCBGA in a 50×50 footprint supports high-density PCB integration while preserving thermal and signal routing considerations.
• RoHS Compliant and Extended Grade: Meets RoHS requirements and operates across an Extended temperature range of 0 °C to 100 °C for a range of commercial and enterprise applications.

Why Choose 1SG280LU3F50E3XGS3?

The 1SG280LU3F50E3XGS3 places the Stratix 10 GX family’s high-performance architecture into a single FCBGA package, offering a combination of large logic capacity, significant on-chip memory, and broad I/O suitable for demanding networking, compute acceleration, and high-throughput embedded designs. Its specification of core voltage range, package type, and operating temperature make it straightforward to evaluate for system-level integration.

This device is appropriate for engineering teams designing high-density FPGA solutions who need verifiable on‑chip resources and the Stratix 10 family capabilities documented in the device overview. The part delivers scalability and predictable hardware resources for multi-gigabit, low-latency, and compute-centric applications.

Request a quote today or submit a procurement inquiry to check availability, lead times, and pricing for the 1SG280LU3F50E3XGS3.