1SG280LU3F50I3XGAS

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA

Quantity 899 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280LU3F50I3XGAS – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA

The 1SG280LU3F50I3XGAS is an Intel Stratix® 10 GX FPGA provided in a 2397‑ball FCBGA package. As a high-density FPGA, it combines a large logic fabric, substantial on-chip memory, and extensive I/O to address advanced, bandwidth‑focused designs.

Built on the Stratix 10 GX family architecture, this device targets applications that require high processing throughput, flexible integration of logic and memory, and support for high‑speed interfaces while operating across an industrial temperature range.

Key Features

  • Core Architecture  Hyperflex core architecture (Stratix 10 GX family) delivering higher core performance compared to previous high‑performance generations, as described in the device family overview.
  • Logic Capacity  2,800,000 logic elements (LEs) providing large programmable fabric for complex algorithms, packet processing, and hardware acceleration tasks.
  • On‑Chip Memory  240,123,904 total RAM bits enabling substantial buffering, lookup tables, and deeply pipelined designs with embedded SRAM resources.
  • I/O and Connectivity  704 I/O pins to support dense external interfacing; family transceiver technology supports high data‑rate links (Stratix 10 GX family transceivers up to 28.3 Gbps as detailed in the device overview).
  • Power Supply  Core supply range of 820 mV to 880 mV for the device core voltage domain.
  • Package and Mounting  2397‑BBGA FCBGA package (50 mm × 50 mm supplier package) designed for surface‑mount PCB assembly in compact, high‑pin‑count systems.
  • Temperature and Grade  Industrial grade operation from −40 °C to 100 °C for deployment in thermally demanding environments.
  • Family-Level IP and Features  Stratix 10 GX family innovations include heterogeneous 3D SiP transceiver tiles, hard IP options (PCIe, Ethernet, memory controllers), and variable precision DSP blocks as described in the device overview.

Typical Applications

  • High‑Performance Networking  Implements packet processing, switching, and protocol acceleration using the device's large logic fabric, abundant RAM, and high‑speed transceiver capabilities.
  • Data Center and Compute Acceleration  Supports custom acceleration engines and offload functions where extensive logic and on‑chip memory provide deterministic, low‑latency processing.
  • Telecommunications and Backplane Systems  Enables high‑bandwidth link aggregation and protocol termination leveraging family transceiver features and abundant I/O.
  • Signal Processing and DSP  Suited for variable precision DSP implementations using the Stratix 10 family DSP resources alongside extensive programmable logic and memory.

Unique Advantages

  • Large, Programmable Fabric: 2.8 million logic elements enable implementation of complex, highly parallel designs without immediate need for external ASICs.
  • Substantial On‑Chip Memory: 240 million+ RAM bits reduce dependence on external memory for buffering and stateful logic, simplifying board-level memory architectures.
  • High‑Density I/O: 704 I/O pins provide flexibility for interfacing to multiple high‑speed peripherals and parallel buses.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C operation to meet demands in industrial and rugged environments.
  • Advanced Family Features: Access to Stratix 10 GX family innovations—Hyperflex core, high‑speed transceiver technology, hard IP blocks and DSP resources—enables integration of high‑throughput subsystems.

Why Choose 1SG280LU3F50I3XGAS?

This Stratix 10 GX device positions itself for designs that demand a combination of high logic capacity, extensive on‑chip memory, and flexible high‑speed I/O in an industrial‑grade package. It is suited for engineers developing high‑throughput networking, compute acceleration, and signal‑processing systems that require significant programmable resources and robust thermal performance.

Choosing this part provides a path to integrate complex algorithms and high‑bandwidth interfaces within a single FPGA platform, benefiting designs that prioritize performance, integration density, and long‑term scalability within the Intel Stratix 10 GX family ecosystem.

Request a quote or submit an inquiry to receive pricing and availability information for 1SG280LU3F50I3XGAS and to discuss how this FPGA can fit into your next high‑performance design.

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