1SG280LU3F50I3XPAS

The Intel Stratix® 10 GX 1SG280LU3F50I3XPAS is a high‑performance Field Programmable Gate Array (FPGA) built on the Stratix 10 GX family architecture. It combines the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) process innovations to address demanding, bandwidth‑ and compute‑intensive designs.

With 2,800,000 logic elements, 240,123,904 bits of on‑chip RAM and 704 I/O pins in a 2397‑FBGA (50×50) surface‑mount package, this industrial‑grade device targets advanced networking, signal processing, and acceleration applications that require dense logic, large embedded memory, and high I/O connectivity.

Key Features

• Core & Architecture  All‑new Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology as described for the Stratix 10 GX family, delivering increased core performance compared to prior generations.
• Logic Capacity  2,800,000 logic elements for complex FPGA designs and large‑scale implementation of custom logic and packet processing engines.
• On‑Chip Memory  240,123,904 total RAM bits of embedded SRAM, with M20K internal memory block support noted in the device family for high‑density buffering and data storage.
• High‑Speed Transceivers & DSP  Family features include heterogeneous 3D SiP transceiver tiles, variable precision DSP blocks, and transceiver data rates referenced in the device overview to support high‑bandwidth links and signal processing workloads.
• Hard IP & Interfaces  Stratix 10 GX family documentation highlights hard PCI Express Gen3 and high‑speed Ethernet/Forward Error Correction IP, enabling robust protocol handling and system integration.
• I/O & Packaging  704 I/O pins in a 2397‑FBGA (2397‑BBGA / 2397‑FBGA, FC 50×50) surface‑mount package, suitable for dense board designs and high‑pin‑count connectivity.
• Power & Operating Range  Core supply voltage range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C; device is RoHS compliant and specified as industrial grade.

Typical Applications

• High‑speed networking and telecom  Use the device's high logic capacity, embedded memory and transceiver capabilities to implement line‑rate packet processing, backplane interfaces and protocol acceleration.
• Data center acceleration  Deploy large custom compute kernels and buffering logic for hardware acceleration tasks that benefit from abundant logic elements and on‑chip RAM.
• Advanced signal processing  Leverage the device family’s DSP resources and high‑speed I/O for real‑time filtering, modulation/demodulation, and multi‑channel data acquisition systems.
• SoC‑style embedded systems  Stratix 10 SoC family variants include an embedded processor subsystem; use the FPGA fabric alongside SoC features for integrated control and data‑plane designs where available.

Unique Advantages

• Massive logic capacity:  2.8 million logic elements enable implementation of very large, highly parallel custom architectures without partitioning across multiple devices.
• Extensive on‑chip memory:  240,123,904 bits of RAM provide deep buffering and state storage to support complex pipelines and high‑throughput data paths.
• High I/O density:  704 I/O pins in a 2397‑FBGA package simplify board routing for systems requiring many external interfaces.
• Industrial operating range:  Rated for −40 °C to 100 °C operation, suitable for industrial environments where broader temperature tolerance is required.
• Family‑level high‑speed features:  Stratix 10 GX family innovations such as Hyperflex architecture, high‑speed transceiver tiles and hard protocol IP reduce integration risk for high‑bandwidth designs.
• Low core voltage operation:  Core supply range of 820 mV to 880 mV supports modern, power‑optimized system designs when combined with appropriate power management.

Why Choose 1SG280LU3F50I3XPAS?

The 1SG280LU3F50I3XPAS provides a high‑capacity, industrial‑grade FPGA option within the Intel Stratix 10 GX family, combining millions of logic elements, substantial on‑chip RAM and a high pin‑count package to address demanding compute and I/O requirements. Its family‑level technologies—Hyperflex architecture, advanced transceivers and hard IP—support the development of high‑performance networking, acceleration and signal processing systems.

Design teams that need scalable logic resources, extensive embedded memory and robust I/O in a surface‑mount 2397‑FBGA package will find this device suitable for complex, high‑bandwidth applications where long‑term platform scalability and support from the Stratix 10 family are important.

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