1SG280LU3F50I3XP

The 1SG280LU3F50I3XP is an Intel Stratix® 10 GX FPGA device offering a high-density programmable fabric with 2,800,000 logic elements and 704 I/O pins in a 2397-BBGA (FCBGA) package. It is built on the Stratix 10 family architecture, which includes the Intel Hyperflex core and Intel 14 nm FinFET process innovations described in the device overview.

Designed for demanding, industrial-grade systems, this device provides large on-chip RAM (240,123,904 bits) and family-level capabilities for high-bandwidth interfaces and advanced signal processing. The device targets applications that require high logic capacity, extensive I/O, and operating range suitable for industrial environments.

Key Features

• High Logic Capacity — 2,800,000 logic elements to implement large, complex designs and high-density custom logic.
• On-chip Memory — 240,123,904 total RAM bits for buffer, packet, and data path storage without relying solely on external memory.
• I/O Density — 704 I/O pins for extensive external device and high-speed interface connectivity.
• Advanced Core Architecture — Built on the Intel Hyperflex core architecture and 14 nm FinFET technology as described for the Stratix 10 family, enabling higher core performance and improved power characteristics at the family level.
• Transceiver and Interface Capabilities (Family-Level) — The Stratix 10 family overview documents high-performance transceiver and hard IP options (including multi‑Gbps transceiver channels and PCIe/ethernet hard IP) available across the family.
• Package and Mounting — 2397-BBGA (FCBGA) supplier package (2397-FBGA, FC 50×50) in a surface-mount form factor for dense board integration.
• Power Supply — Core supply range specified at 820 mV to 880 mV for integrated power planning.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• High‑performance Networking — Implement packet processing, switching, and line-rate protocol engines leveraging the device’s large logic capacity and extensive I/O.
• Data Center and Telecom Infrastructure — Use for host adapters, protocol offload, and acceleration tasks that require dense logic and on-chip RAM.
• Signal Processing and Acceleration — Deploy in FPGA-based acceleration for DSP workloads using the fabric and large memory resources.
• Test, Measurement, and Industrial Systems — Integrate into complex instrumentation and industrial controllers requiring wide temperature range and high I/O counts.

Unique Advantages

• Extensive Logic Resources: 2.8 million logic elements enable large-scale, high-complexity designs without excessive partitioning.
• Large On‑Chip RAM: 240,123,904 bits of internal RAM reduce dependency on external memory for buffering and data-path operations.
• High I/O Count: 704 I/O pins support multiple high-speed interfaces and dense system integration.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in industrial environments.
• Low-Voltage Core Supply: 820–880 mV core voltage range supports low-power core operation and clear power budgeting.
• Surface-Mount BGA Package: 2397‑BBGA (FCBGA) package allows for compact, high-density PCB layouts.

Why Choose 1SG280LU3F50I3XP?

The 1SG280LU3F50I3XP positions itself as a high-density Stratix 10 GX FPGA option for industrial applications that require substantial programmable logic, abundant on-chip RAM, and a large I/O footprint. Its specifications support complex data-path designs, high-throughput interfacing, and durable operation across a wide temperature range.

For teams designing advanced networking, compute acceleration, or industrial instrumentation, this device offers a scalable platform within the Stratix 10 family, combining family-level architectural innovations and the concrete device-level resources needed to realize large, high-performance systems.

Request a quote or submit an inquiry for pricing and availability to evaluate the 1SG280LU3F50I3XP for your next design.