1ST040EH1F35E2VG

The 1ST040EH1F35E2VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC from Intel, delivering a high count of programmable logic and on-chip memory for complex digital designs. With 378,000 logic elements, 31,457,280 total RAM bits and 384 I/Os, it is targeted at designs that require significant logic density, substantial on-chip RAM capacity and extensive I/O resources.

Packaged in a 1152-BBGA (35 × 35 mm) FCBGA and specified for extended-grade operation, this device supports surface-mount assembly and RoHS-compliant production flows.

Key Features

• Core Logic  378,000 logic elements provide hardware resources for large-scale digital designs and complex custom logic implementations.
• On-Chip Memory  31,457,280 total RAM bits enable substantial buffering, state storage, and local data processing without external memory for many use cases.
• I/O Capacity  384 I/Os offer flexible interfacing options for multi-channel systems and dense board-level connectivity.
• Package and Mounting  1152-BBGA (FCBGA) package with a 35 × 35 mm footprint supports high pin-count integration in a surface-mount form factor.
• Power  Supported supply voltage range of 770 mV to 970 mV enables integration into systems with low-voltage core rails.
• Temperature and Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C for applications requiring above-standard commercial temperature performance.
• Environmental Compliance  RoHS compliant to support regulatory-driven manufacturing and assembly processes.

Typical Applications

• High-density digital processing  Large logic element count and on-chip RAM suit complex data-paths, signal processing, and algorithm acceleration within a single FPGA.
• Embedded system integration  Extensive I/O and memory resources support consolidation of multiple functions onto one device for space- and BOM-constrained embedded designs.
• Prototyping and hardware development  Large logic and memory capacity enable development and validation of complex hardware architectures and system-level prototypes.
• I/O-rich control and interfacing  384 I/Os provide flexibility for designs that require broad peripheral or sensor connectivity and board-level aggregation.

Unique Advantages

• High logic density: 378,000 logic elements reduce the need for multiple devices, simplifying system architecture and lowering board-level complexity.
• Substantial on-chip RAM: 31,457,280 bits of RAM support larger buffering and local data processing, reducing dependency on external memory for many functions.
• Flexible connectivity: 384 I/Os enable broad interfacing options, making it easier to consolidate I/O-intensive functions on a single FPGA.
• Compact high-pin package: The 1152-BBGA FCBGA (35 × 35 mm) offers high pin count in a compact footprint for dense system designs.
• Extended-grade operation: Specified 0 °C to 100 °C operating range supports deployments that require wider temperature capability than standard commercial parts.
• RoHS compliant: Supports environmentally regulated manufacturing and assembly processes.

Why Choose 1ST040EH1F35E2VG?

The 1ST040EH1F35E2VG combines a high number of logic elements, large on-chip RAM and significant I/O capacity in a compact 1152-BBGA package, making it suitable for engineers designing dense, I/O-rich FPGA-based systems. Its extended-grade temperature specification and RoHS compliance provide practical deployment characteristics for production environments.

This device is positioned for designs that demand scalable logic resources, ample local memory and flexible board-level connectivity—helping reduce external component count and simplify system integration while supporting surface-mount assembly processes.

Request a quote or submit a quote to evaluate the 1ST040EH1F35E2VG for your next FPGA-based design.