1ST040EH1F35I2LG

The 1ST040EH1F35I2LG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1152-ball BGA/FBGA package. It provides a high-density programmable fabric with substantial on-chip RAM and a large I/O count, designed for industrial-grade environments.

With 378,000 logic elements and 31,457,280 total RAM bits, this device targets designs that require significant logic capacity, abundant embedded memory, and robust I/O integration while operating across a wide industrial temperature range.

Key Features

• Core Logic — 378,000 logic elements to implement complex programmable logic and custom accelerators.
• On‑Chip Memory — 31,457,280 total RAM bits for buffering, data storage, and intermediate computation without external memory.
• I/O Density — 384 I/O pins to support multiple interfaces and extensive peripheral connectivity.
• Package and Mounting — 1152-BBGA (supplier device package: 1152-FBGA 35×35) in a surface-mount form factor for compact board integration.
• Power Supply — Supported core voltage range from 870 mV to 970 mV, enabling precise power budgeting and supply design.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control — Implement real-time control logic and deterministic processing where wide temperature range and industrial grade components are required.
• High‑Density Logic Integration — Consolidate multiple functions into a single FPGA using the large pool of logic elements and embedded RAM.
• Data Acquisition and Processing — Use the on-chip RAM and abundant I/O for intermediate buffering and parallel data handling in measurement or sensing systems.

Unique Advantages

• Large Logic Capacity: 378,000 logic elements enable substantial on‑chip implementation of custom algorithms and hardware acceleration.
• Significant Embedded Memory: 31,457,280 RAM bits reduce dependence on external memory for many buffering and storage needs.
• High I/O Count: 384 I/Os simplify interfacing to sensors, peripherals, and external devices without extensive multiplexing.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for demanding industrial deployments.
• Compact Surface‑Mount Package: 1152-ball BGA/FBGA packaging supports dense PCB layouts while maintaining robust electrical connections.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product development and manufacturing.

Why Choose 1ST040EH1F35I2LG?

The 1ST040EH1F35I2LG combines substantial logic density, large on‑chip RAM, and high I/O capability in a compact 1152‑ball BGA package, making it well suited for industrial designs that require integration of complex logic and data buffering while operating across a broad temperature range. Its specified core voltage window and surface‑mount packaging support predictable power and PCB integration decisions.

This FPGA is appropriate for engineering teams building industrial control, data acquisition, or high‑integration systems that benefit from programmable hardware capacity and the reliability expectations associated with industrial-grade components.

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