1ST040EH2F35E2LG

The 1ST040EH2F35E2LG is a Stratix® 10 TX field programmable gate array (FPGA) from Intel, built to provide substantial on-chip logic and memory resources in a high-pin-count BGA package. This device integrates 378,000 logic elements and 31,457,280 bits of total RAM to support complex, configurable digital designs that require abundant logic capacity, on-chip storage, and extensive I/O connectivity.

With a supply voltage range of 870 mV to 970 mV and an operating temperature range of 0 °C to 100 °C, the part is provided in a surface-mount 1152-FBGA (35×35) package and is RoHS compliant.

Key Features

• Core Logic 378,000 logic elements provide a large programmable fabric for implementing complex digital functions and custom processing pipelines.
• On-Chip Memory 31,457,280 bits of total RAM enable substantial buffering, lookup tables, and on-device storage for data-path and control logic.
• I/O Capacity 384 I/O pins support extensive peripheral, memory, and high-pin-count interface requirements in system designs.
• Power Supply Designed to operate with a core voltage supply in the range of 870 mV to 970 mV.
• Package and Mounting 1152-FBGA (35×35) surface-mount package (1152-BBGA, FCBGA) provides a high-density footprint for board-level integration.
• Temperature Range Specified for operation from 0 °C to 100 °C to meet standard commercial environmental requirements.
• Compliance RoHS compliant.

Typical Applications

• High-density digital processing — Implement custom datapaths and complex control logic using the device’s large pool of logic elements and on-chip RAM.
• Interface aggregation — Support multiple high-pin-count interfaces and signal routing with 384 available I/O pins.
• Prototyping and system integration — Use the FPGA’s configurable fabric and memory resources to prototype custom silicon functions or to integrate multiple functions into a single device.

Unique Advantages

• Substantial logic capacity: 378,000 logic elements enable implementation of large, complex designs without immediate partitioning across multiple devices.
• Large on-chip RAM: Over 31 million bits of RAM reduce reliance on external memory for many buffering and storage needs, simplifying board-level design.
• High I/O count: 384 I/Os accommodate numerous interfaces and peripherals, minimizing the need for external I/O expanders.
• Compact, high-density package: The 1152-FBGA (35×35) package allows integration of a large FPGA in a manageable PCB footprint for high-density boards.
• Commercial temperature rating: Rated for 0 °C to 100 °C operation for standard commercial deployments.
• RoHS compliant: Conforms to RoHS requirements for lead-free assembly processes.

Why Choose 1ST040EH2F35E2LG?

The 1ST040EH2F35E2LG combines a sizable programmable fabric with extensive on-chip memory and a high I/O count in a single surface-mount FBGA package. This configuration is suited to teams and designs that need to consolidate multiple functions into one device, accelerate development through reprogrammability, and support complex data-path and interface requirements without proliferating external components.

Manufactured by Intel, the device is positioned for applications that require significant logic and memory resources within a commercial temperature range, offering a balance of integration and scalability for medium- to large-scale FPGA-based designs.

Request a quote or submit an inquiry today to evaluate the 1ST040EH2F35E2LG for your next FPGA design.