1ST040EH2F35I2LG

The 1ST040EH2F35I2LG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC designed for high-density programmable logic and on-chip memory integration. It delivers a large logic fabric combined with substantial embedded RAM and a wide I/O complement in a compact surface-mount FCBGA package.

With 378,000 logic elements, 31,457,280 total RAM bits, and 384 I/O, this industrial-grade device is suited to designs that require significant logic capacity, on-chip memory resources, and robust thermal tolerance across an operating range of −40°C to 100°C.

Key Features

• Core Logic  Provides 378,000 logic elements to implement complex programmable logic, custom datapaths, and heavy parallelism.
• On-Chip Memory  Total of 31,457,280 RAM bits available for buffering, shared memory, and embedded data structures within the FPGA fabric.
• I/O Density  384 I/O pins support high pin-count interfacing and dense external connectivity for peripherals and high-speed links.
• Power Supply  Operates from an input supply range of 870 mV to 970 mV, enabling clear power budgeting for core domains.
• Package and Mounting  Supplied in a 1152-BBGA (1152-FBGA, 35×35) surface-mount FCBGA package suited for compact board layouts.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C, supporting thermal requirements for industrial applications.
• Regulatory  RoHS compliant for environmental and manufacturing process compatibility.

Typical Applications

• Custom Hardware Acceleration  Implement accelerators that leverage 378,000 logic elements and extensive on-chip RAM to offload compute-intensive functions.
• Data Buffering and Packet Processing  Use the 31,457,280 RAM bits and 384 I/O to build high-throughput buffering and packet handling architectures.
• High-Density I/O Control  Deploy the 384 I/O pins for complex multi-channel control, sensor aggregation, and interface bridging.
• Industrial Embedded Systems  Industrial-grade temperature range and surface-mount FCBGA packaging make the device suitable for rugged embedded designs requiring reliability.

Unique Advantages

• High Logic Capacity: 378,000 logic elements enable substantial on-chip computation and parallel processing without immediate external ASIC complexity.
• Large On-Chip Memory: 31,457,280 RAM bits reduce dependence on external memory for many buffering and stateful processing tasks, simplifying board-level design.
• Dense I/O Integration: 384 I/O pins provide flexibility to connect multiple interfaces and high-speed links while consolidating package pin usage.
• Compact FCBGA Package: 1152-FBGA (35×35) package supports dense PCB routing and surface-mount assembly for space-constrained applications.
• Industrial Reliability: Rated for −40°C to 100°C operation and RoHS compliant, delivering robust operation over a broad thermal range with compliant manufacturing.

Why Choose 1ST040EH2F35I2LG?

The 1ST040EH2F35I2LG Stratix® 10 TX FPGA combines high logic density, substantial embedded memory, and a large I/O count in a compact FCBGA package, providing a balanced platform for complex, high-performance programmable designs. Its industrial temperature rating and RoHS compliance make it suitable for long-life embedded and industrial deployments that require reliable operation across varied thermal conditions.

This device is well suited for engineers and designers building systems that need scalable logic resources, on-chip memory capacity, and robust I/O integration—delivering a solution that simplifies system architecture while supporting demanding processing and interfacing requirements.

Request a quote or submit an inquiry to receive pricing and availability for the 1ST040EH2F35I2LG Stratix® 10 TX FPGA and to discuss how it can fit your project requirements.