1SG280LU2F50E2VGAS

The 1SG280LU2F50E2VGAS is a Stratix® 10 GX FPGA family device designed for high-performance, bandwidth‑intensive applications. It leverages the Intel Hyperflex™ core architecture and 14 nm tri‑gate (FinFET) technology to deliver substantial core performance and power efficiency improvements described for the Stratix 10 series.

This device targets advanced communications, compute acceleration, and high‑speed I/O applications where large logic capacity, extensive on‑chip memory, and high‑speed transceivers are required. It is offered in an extended grade and packaged in a 2397‑BBGA FCBGA surface‑mount form factor.

Key Features

• Core architecture — Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) process technology provide the architectural improvements outlined for the Stratix 10 family.
• Logic capacity — 2,800,000 logic elements to implement large, complex designs and custom hardware accelerators.
• On‑chip memory — 240,123,904 total RAM bits, with internal M20K SRAM memory block architecture referenced for the Stratix 10 family.
• I/O and transceivers — 704 I/O pins and support for high‑speed transceiver capabilities described in the Stratix 10 GX series, including heterogeneous 3D SiP transceiver tiles and multi‑Gbps channel operation.
• Hard IP and DSP — Series documentation references hard PCI Express® Gen3, 10G Ethernet features, and variable precision DSP blocks for heavy signal‑processing workloads.
• Package and mounting — 2397‑BBGA, FCBGA package in a surface‑mount configuration; supplier device package listed as 2397‑FBGA, FC (50×50).
• Power supply — Core voltage supply range of 770 mV to 970 mV as specified for this device.
• Temperature and grade — Extended grade device rated for an operating range of 0°C to 100°C; RoHS compliant.

Typical Applications

• High‑speed networking — Implements packet processing, protocol offload, and line‑rate functions using on‑chip transceivers and hard 10G/40G Ethernet IP referenced for the series.
• Data center acceleration — Large logic and memory resources enable custom acceleration for compression, encryption, and database query offloads.
• Backplane and module interfaces — High‑bandwidth transceiver channels and PCI Express® hard IP make the device suitable for backplane and module connectivity tasks.
• Signal processing and DSP — Variable precision DSP blocks and ample on‑chip RAM support demanding DSP workloads and real‑time processing pipelines.

Unique Advantages

• Significant logic scale: 2.8 million logic elements support highly parallel designs and large state machines without external logic expansion.
• Extensive on‑chip memory: Nearly 240 million bits of RAM reduce reliance on external memory and improve data locality for throughput‑sensitive designs.
• High‑performance I/O: 704 I/O pins and the series’ high‑speed transceiver architecture enable broad interface flexibility and multi‑Gbps connectivity.
• Package options for dense designs: 2397‑BBGA FCBGA packaging in a 50×50 form factor supports compact, high‑density board layouts.
• Power and thermal profile: Core supply range of 770 mV–970 mV and extended‑grade temperature support help designers balance performance and thermal budgeting.
• Standards‑oriented hard IP: Inclusion of series‑level hard IP such as PCIe and 10G Ethernet reduces development time for common subsystems.

Why Choose 1SG280LU2F50E2VGAS?

The 1SG280LU2F50E2VGAS delivers the capacity and interfaces needed for demanding, bandwidth‑centric systems. With 2.8 million logic elements, substantial on‑chip RAM, and the Stratix 10 GX family’s high‑speed transceiver and hard IP features, this device is positioned for designs that require dense logic, heavy DSP, and multi‑Gbps I/O.

Engineers and procurement teams seeking a high‑performance FPGA in an extended‑grade, surface‑mount BBGA package will find this part suited to complex communications, compute‑acceleration, and signal‑processing applications where integration and on‑chip resources reduce system complexity and BOM size.

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