1SG280LN3F43I1VP

The 1SG280LN3F43I1VP is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-BBGA FCBGA package. It combines a large programmable fabric—2,800,000 logic elements—with abundant on-chip RAM and a high I/O count to address demanding bandwidth and processing applications.

Designed for industrial-grade systems, this device targets high-performance networking, compute acceleration, and complex embedded logic implementations where high logic capacity, extensive memory, and flexible I/O are required.

Key Features

• High Logic Capacity  2,800,000 logic elements to implement large-scale digital designs and multiple concurrent functions within a single device.
• On‑Chip Memory  240,123,904 total RAM bits for deep buffering, large lookup tables, or wide on‑chip data storage.
• Extensive I/O  688 general-purpose I/O pins to support dense connectivity to peripherals, memory, and high-speed interfaces.
• Package & Mounting  1760-BBGA (FCBGA) supplier device package, 1760-FBGA (42.5 × 42.5 mm) form factor, surface-mount for compact system integration.
• Core Voltage Range  Supported supply voltage range from 770 mV to 970 mV for the device core.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet robust environmental requirements.
• Standards & Compliance  RoHS compliant to support regulatory and manufacturing requirements.
• Intel Stratix 10 Family Innovations  Based on Stratix 10 GX family architecture (including Hyperflex core architecture and heterogeneous 3D SiP transceiver technology as described in the Stratix 10 GX/SX overview), providing a modern high-performance FPGA foundation.

Typical Applications

• High‑Performance Networking  Implement packet processing, switching, and protocol offload functions that require large logic fabrics, extensive on‑chip memory, and many I/O channels.
• Data Center Acceleration  Deploy compute accelerators and custom processing pipelines that leverage the device’s large logic capacity and RAM for low‑latency data handling.
• Telecommunications & Backplane Interfaces  Integrate complex PHY, MAC, and framing logic with multiple I/O connections and on‑chip storage for buffering and jitter mitigation.
• Advanced Embedded Systems  Consolidate multiple system functions—control, signal processing, and protocol handling—onto a single industrial‑grade FPGA platform.

Unique Advantages

• High-density programmable fabric: 2.8M logic elements enable large, consolidated designs that reduce part count and system complexity.
• Large on-chip RAM: 240,123,904 bits of RAM support deep buffering and data‑intensive processing without immediate reliance on external memory.
• Broad I/O availability: 688 I/O pins simplify integration with multi‑lane interfaces, memory buses, and mixed-signal front ends.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding environments.
• Compact, manufacturable package: 1760-BBGA FCBGA packaging and surface-mount mounting streamline board-level design for high-density systems.
• RoHS compliant: Aligns with common manufacturing and environmental requirements.

Why Choose 1SG280LN3F43I1VP?

The 1SG280LN3F43I1VP positions itself as a high-capacity, industrial-grade Stratix 10 GX FPGA option for system designers who need large programmable resources, significant on‑chip memory, and extensive I/O in a single package. Its specification set supports complex networking, acceleration, and embedded applications where consolidating functionality onto one FPGA reduces board-level complexity.

Choosing this device delivers scalability for evolving designs and leverages the Stratix 10 GX family architecture to address performance and integration challenges while meeting industrial environmental requirements and RoHS compliance.

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