1ST085EN1F43E2LG

The 1ST085EN1F43E2LG is a Stratix® 10 TX field programmable gate array (FPGA) in a 1760‑FBGA surface‑mount package. It is part of the Stratix 10 TX device family and is built for high‑performance, high‑bandwidth programmable designs that require large logic capacity, abundant on‑chip RAM, and advanced high‑speed transceiver support.

With 850,000 logic elements and dual‑mode transceiver technology described for the Stratix 10 TX family, this device targets applications that demand extensive programmable fabric, large on‑chip memory, and dense I/O in a compact FCBGA package.

Key Features

• Core Capacity — 850,000 logic elements provide substantial programmable logic resources for complex FPGA designs.
• On‑Chip Memory — 71,303,168 total RAM bits for large buffering, state storage, and memory‑intensive logic functions.
• I/O Density — 440 I/O pins support a wide range of external interfaces and high pin‑count applications.
• Transceiver Architecture (series) — Stratix 10 TX family dual‑mode transceivers support both PAM4 and NRZ signaling modes, enabling high aggregated bandwidth (series documentation references aggregate bandwidth capability up to and beyond multi‑Tbps levels).
• Advanced Core Architecture (series) — Stratix 10 TX family includes the HyperFlex® core architecture and 14 nm FinFET technology as described in the series overview.
• Package and Mounting — 1760‑FBGA (42.5×42.5 mm) FCBGA package; surface mount for PCB integration.
• Power Supply — Core voltage supply range 820 mV to 880 mV to match board power design requirements.
• Operating Range and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High‑speed networking and backplane communications — Dual‑mode transceiver capability and high I/O density make the device suitable for chip‑to‑chip, chip‑to‑module, and backplane link implementations described for the Stratix 10 TX family.
• Data center and telecom systems — Large logic capacity and substantial on‑chip RAM support packet processing, FEC, and high‑bandwidth aggregation functions referenced in the series documentation.
• Compute acceleration and programmable systems — High logic and memory resources enable hardware acceleration and complex FPGA‑based processing tasks.

Unique Advantages

• High logic and memory capacity: 850,000 logic elements and over 71 million RAM bits enable large, complex designs without immediate external memory dependence.
• Dense I/O and package integration: 440 I/O in a 1760‑FBGA (42.5×42.5 mm) package provides a compact, high‑pin‑count solution for space‑constrained boards.
• Series‑level high‑speed transceiver support: Stratix 10 TX series transceiver technology supports both PAM4 and NRZ signaling modes for flexible high‑bandwidth links.
• Optimized power envelope: Core supply range of 820–880 mV supports targeted power delivery design and thermal planning.
• Extended operating range: 0 °C to 100 °C operating temperature suits a wide set of commercial and enterprise environments.
• RoHS compliant: Meets common environmental and manufacturing requirements.

Why Choose 1ST085EN1F43E2LG?

The 1ST085EN1F43E2LG combines large programmable fabric, significant on‑chip memory, and high I/O density in a compact 1760‑FBGA package, making it well suited for designs that require both logic scale and high‑bandwidth connectivity. As a member of the Stratix 10 TX family, it benefits from the series' architectural advances and high‑speed transceiver capabilities documented for the family.

This device is positioned for engineers developing demanding networking, telecom, and compute‑oriented FPGA systems that need scalable logic capacity, extensive RAM resources, and robust I/O. Its extended grade and RoHS compliance support deployment in a range of commercial and enterprise environments while aligning with established design practices for power and thermal management.

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