1ST085EN1F43I2LG

The 1ST085EN1F43I2LG is an Intel Stratix® 10 TX family FPGA offered in a 1760-ball FCBGA package. It delivers a high logic capacity and dense I/O in a single surface-mount device aimed at demanding, industrial-grade applications.

Built around the Stratix 10 TX series architecture, the device benefits from the family’s innovations such as the HyperFlex core architecture and high-speed transceiver technology, making it suitable for high-bandwidth chip-to-chip, chip-to-module, and backplane applications.

Key Features

• Logic Capacity  Provides 850,000 logic elements for complex digital designs and large-scale FPGA implementations.
• On‑chip Memory  Includes 71,303,168 total RAM bits to support large buffering, packet processing, and state storage.
• I/O and Connectivity  Offers 440 general-purpose I/O pins to support high-density external interfaces and board-level connectivity.
• High‑speed Transceiver Technology  Part of the Stratix 10 TX family, which features dual-mode transceivers capable of PAM4 and NRZ operation for chip-to-chip, chip-to-module, and backplane use cases.
• Hardened IP (Series Capability)  Stratix 10 TX series includes hardened PCI Express Gen3 and high‑rate Ethernet MAC IP blocks, useful for systems requiring integrated protocol engines (series-level feature).
• Power and Supply  Core voltage supply range is specified at 820 mV to 880 mV to match precision power-rail designs.
• Package and Mounting  Supplied in a 1760-ball FBGA (42.5 × 42.5 mm) surface-mount package for compact, high-density board layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Backplane and High-Speed Links  Used for chip-to-module and backplane connectivity where the Stratix 10 TX transceiver capabilities and large logic capacity enable high-bandwidth data movement.
• PCI Express Systems  Appropriate for systems leveraging hardened PCI Express Gen3 IP in the Stratix 10 TX family for direct PCIe endpoint or root complex implementations.
• High‑Rate Ethernet and Packet Processing  Fits designs that require hardware-accelerated Ethernet MACs and large on-chip RAM for packet buffering and FEC processing (series-level features).

Unique Advantages

• High Logic Density:  850,000 logic elements enable implementation of complex algorithms and large custom accelerators on a single device.
• Substantial On‑chip Memory:  Over 71 million bits of RAM reduce reliance on external memory for many buffering and stateful workloads.
• Robust I/O Count:  440 I/O pins support dense external connectivity without sacrificing board-level flexibility.
• Industrial Temperature Range:  −40 °C to 100 °C rating supports deployment in rugged and industrial environments.
• Compact High‑density Package:  1760-ball FCBGA (42.5 × 42.5 mm) enables integration into space-constrained system designs while retaining high pin count.
• Family-Level High-Speed Capabilities:  As a member of the Stratix 10 TX family, the device shares access to advanced transceiver and hardened IP features that streamline high-bandwidth system design.

Why Choose 1ST085EN1F43I2LG?

This Stratix 10 TX device combines substantial logic and memory resources with a high count of I/O in a compact industrial-grade package. It is well suited for engineers designing high-bandwidth connectivity, protocol acceleration, and complex FPGA-accelerated processing where on-chip resources and board-level integration matter.

Choosing 1ST085EN1F43I2LG provides a scalable hardware foundation from the Stratix 10 TX family, offering series-level transceiver and hardened-IP innovations alongside the device’s specific capacity, package, supply, and temperature specifications to meet long-term deployment needs.

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