1ST085EN2F43E2LG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 850000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 86 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 440 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 106250 | Number of Logic Elements/Cells | 850000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 71303168 |
Overview of 1ST085EN2F43E2LG – Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 I/O, 850,000 Logic Elements, 1760-BBGA
The 1ST085EN2F43E2LG is an Intel Stratix® 10 TX family FPGA in a 1760-ball FCBGA package designed for high-density, high-bandwidth programmable logic. It combines a large programmable fabric (850,000 logic elements) with 440 device I/Os and 71,303,168 bits of on-chip RAM to address demanding data-path, communication and compute-acceleration applications.
As an Extended-grade, surface-mount device with a supply voltage range of 820 mV to 880 mV and an operating temperature range of 0 °C to 100 °C, this Stratix 10 TX device targets systems that require high integration, advanced transceiver capability and substantial on-chip memory and logic resources.
Key Features
- High Logic Density — 850,000 logic elements for implementing complex digital designs and large-scale custom logic.
- On-chip Memory — 71,303,168 total RAM bits to support large buffering, packet processing, or data-intensive compute tasks.
- Rich I/O — 440 device I/Os to support wide parallel interfaces, multiple memory channels, and high-pin-count system integration.
- Advanced Transceiver Technology — Stratix 10 TX family features dual-mode transceivers supporting high-rate PAM4 and NRZ operation and hardened high-speed protocol IP (family-level feature).
- Core Architecture — Family HyperFlex® core architecture delivering significantly increased core performance over prior generations (family-level characteristic).
- Package & Mounting — 1760-ball BBGA / FCBGA package (1760-FBGA, 42.5 × 42.5 mm) in a surface-mount form factor for dense PCB integration.
- Power and Temperature — Supported supply range 820 mV–880 mV with an operating temperature range of 0 °C to 100 °C; Extended grade device for broader system applicability.
- Compliance — RoHS compliant.
Typical Applications
- Data Center Networking — High logic density and large on-chip RAM support packet processing, traffic management and network acceleration functions.
- Telecom & Optical Transport — Family transceiver capabilities and hardened protocol IP make this device suitable for high-speed serial links and backplane or module-level interconnects.
- High-Performance Compute Acceleration — Large logic and memory resources enable custom accelerators for signal processing, compression, or algorithm offload.
- PCI Express and Interconnect Systems — Use in systems requiring programmable fabric alongside hardened high-speed I/O and protocol blocks (family-level features).
Unique Advantages
- Large, Scalable Fabric: 850,000 logic elements provide capacity for complex SoC-class designs and increased on-board functionality.
- Substantial On-Chip Memory: 71,303,168 bits of RAM reduce dependency on external memory for buffering and intermediate storage.
- High I/O Count: 440 I/Os enable flexible system connectivity and multi-channel interfacing without extensive external bridging.
- Advanced Family-Level Transceiver & IP: Stratix 10 TX family innovations (dual-mode transceivers, hardened protocol IP) support high-bandwidth system requirements.
- Compact, Production-Ready Package: 1760-ball FCBGA package (42.5 × 42.5 mm) for dense PCB layouts and surface-mount assembly.
- Extended-Grade Operation: 0 °C to 100 °C operating range and RoHS compliance for broad deployment scenarios.
Why Choose 1ST085EN2F43E2LG?
The 1ST085EN2F43E2LG delivers a combination of high logic density, ample on-chip RAM and robust I/O count in a production-ready FCBGA package. As part of the Stratix 10 TX family, it incorporates architecture and transceiver innovations that address high-throughput communications and compute-acceleration needs while providing a clear upgrade path within the family.
This device is well suited for engineering teams designing high-bandwidth network equipment, compute accelerators, and complex embedded systems that require substantial programmable resources and advanced I/O capability. It offers long-term design scalability through the Stratix 10 TX family feature set and comprehensive technical documentation.
Request a quote or submit an inquiry to get availability, pricing, and lead-time information for 1ST085EN2F43E2LG. Our team will provide the details you need to evaluate this device for your next design.

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