1ST085EN1F43I1VGAS

The 1ST085EN1F43I1VGAS is a Stratix® 10 TX Field Programmable Gate Array in a 1760‑BGA package targeted for high‑performance, industrial-grade applications. This device integrates 850,000 logic elements and 71,303,168 bits of on‑chip RAM to address complex digital signal processing, networking, and compute‑acceleration tasks.

As a member of the Stratix 10 TX family, it leverages the family’s high‑speed transceiver and HyperFlex® core architecture innovations to deliver the compute density and I/O capability required for demanding designs while supporting a broad operating range and surface‑mount packaging for system integration.

Key Features

• Core Logic — 850,000 logic elements provide substantial programmable fabric for large, parallel designs and complex custom logic implementations.
• On‑Chip Memory — 71,303,168 total RAM bits suitable for buffering, lookup tables, and intermediate data storage in high‑throughput designs.
• I/O and Package — 440 user I/Os in a 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) surface‑mount package for dense connectivity and board‑level routing.
• Transceiver and Family-Level Connectivity — Stratix 10 TX family devices feature dual‑mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation and hardened protocol IP (including PCIe Gen3 and 10/25/100 Gbps Ethernet MAC IP) for high‑bandwidth chip‑to‑chip, module, and backplane links.
• Power Supply Range — Core supply range 770 mV to 970 mV to match system power domains and enable power management planning.
• Industrial Temperature Range — Specified for −40 °C to 100 °C operation to meet a wide range of deployed‑environment requirements.
• Compliance — RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• High‑Performance Networking — Use in switches, routers, and line‑cards where large programmable fabric, extensive RAM, and high‑speed transceivers support multi‑100 Gbps packet processing and MAC/FEC implementations.
• Telecom and Optical Systems — Suitable for module and backplane interfaces that require PAM4/NRZ dual‑mode transceiver links and dense I/O for signal aggregation and protocol bridging.
• Compute Acceleration — Hardware acceleration for algorithms that need parallel processing and sizeable on‑chip memory, such as signal processing, analytics, and custom compute pipelines.
• Test, Measurement and Prototyping — Platform for validating high‑speed interfaces, custom IP, and system‑level prototypes requiring a large logic and memory footprint in an industrial temperature device.

Unique Advantages

• High Logic Density: 850,000 logic elements enable consolidation of multi‑function designs onto a single FPGA, reducing external glue logic and board complexity.
• Substantial On‑Chip RAM: Over 71 million bits of RAM support buffering, state machines, and data‑intensive algorithms without relying solely on external memory.
• Robust I/O and Packaging: 440 I/Os in a 1760‑FBGA footprint give flexibility for dense system interconnects and complex PCB routes.
• Industrial Temperature Spec: −40 °C to 100 °C rating supports deployment in harsher environments where extended temperature tolerance is required.
• Family‑Level High‑Speed Connectivity: Access to Stratix 10 TX family transceiver capabilities and hardened protocol IP enables integration with modern high‑bandwidth links and standards.
• Regulatory Ready: RoHS compliance simplifies manufacturing and global deployment considerations.

Why Choose 1ST085EN1F43I1VGAS?

The 1ST085EN1F43I1VGAS offers a balanced combination of large programmable fabric, extensive on‑chip memory, and ample I/O in a single industrial‑grade FPG A package. It is positioned for teams building high‑bandwidth networking, telecom, and compute‑intensive systems that require a high level of integration and a wide operating temperature range.

Choosing this Stratix 10 TX device helps designers scale complex logic and memory requirements within a compact, surface‑mount form factor while leveraging the family’s advanced transceiver and architectural features for future growth and system-level integration.

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