1ST085EN1F43E2VG

IC FPGA 440 I/O 1760FBGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 850000 1760-BBGA, FCBGA

Quantity 3 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs106250Number of Logic Elements/Cells850000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits71303168

Overview of 1ST085EN1F43E2VG – Stratix® 10 TX FPGA, 850,000 Logic Elements, 1760-BBGA

The 1ST085EN1F43E2VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) offered in a 1760-ball BGA package. It pairs a high-capacity logic fabric with advanced transceiver and system features from the Stratix 10 TX device family.

Designed for high-bandwidth, high-performance systems, this device targets applications that require large programmable logic resources, extensive I/O, and the transceiver and interface capabilities provided by the Stratix 10 TX architecture.

Key Features

  • Logic Capacity  Approximately 850,000 logic elements, providing substantial programmable fabric for complex designs.
  • Adaptive Logic Modules  106,250 ALM/CLB equivalents reported in the product data to support flexible logic implementation.
  • On‑Chip Memory  Total internal RAM of 71,303,168 bits to support large buffering, caching, and on‑chip data structures.
  • High‑Density I/O  440 I/O pins for broad external interface options and system connectivity.
  • Advanced Transceiver Technology  Stratix 10 TX family transceivers support dual‑mode operation (PAM4 and NRZ) and high data rates as described for the device series.
  • Hard IP and DSP  Family documentation specifies hardened PCIe Gen3 and Ethernet MAC IPs as part of the Stratix 10 TX feature set, plus hardened DSP resources for signal processing tasks.
  • Package  1760‑BBGA (FCBGA) in a 1760‑FBGA supplier package footprint (42.5 × 42.5 mm) for high‑pin‑count board integration.
  • Power  Core voltage supply range specified at 770 mV to 970 mV to align with the device power requirements.
  • Temperature Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
  • Mounting  Surface‑mount device, suited for standard PCB assembly processes.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • High‑Speed Networking & Switching  Use in systems that require large programmable logic capacity and high aggregate bandwidth for packet processing and switching functions.
  • Data Center I/O and Acceleration  Suitable for I/O expansion, protocol bridging, and hardware acceleration where dense logic and on‑chip memory reduce external component count.
  • Backplane and Module Interfaces  Supports chip‑to‑chip, chip‑to‑module, and backplane applications leveraging the Stratix 10 TX transceiver capabilities described for the device family.
  • PCI Express Platforms  Applicable in systems using PCI Express Gen3 hard IP available within the Stratix 10 TX device family for high‑throughput host or endpoint designs.
  • Signal Processing and DSP  Hardened DSP resources and large internal RAM enable compute‑intensive signal processing workloads.

Unique Advantages

  • Large Programmable Fabric:  Around 850,000 logic elements provide the capacity to implement complex state machines, protocol stacks, and custom accelerators on a single device.
  • Extensive On‑Chip Memory:  Over 71 million bits of internal RAM reduce dependency on external memory for buffers and caches, simplifying board design.
  • High I/O Count:  440 I/O pins enable broad connectivity to peripherals, high‑speed transceivers, and board routing flexibility.
  • Advanced Transceiver and Interface IP:  Stratix 10 TX family transceiver and hardened IP (Ethernet MAC, PCIe) support high‑bandwidth interfaces common in networking and data center designs.
  • Integration and Packaging:  1760‑ball BGA packaging (42.5 × 42.5 mm supplier footprint) consolidates a high pin‑count solution into a single surface‑mount device.
  • Designed for Performance Systems:  Features described for the Stratix 10 TX family, including HyperFlex core architecture and heterogeneous packaging technologies, support demanding system requirements.

Why Choose 1ST085EN1F43E2VG?

The 1ST085EN1F43E2VG brings significant programmable logic capacity, substantial on‑chip memory, and a high I/O count in a single 1760‑ball FCBGA package. It is positioned for designs that require large FPGA fabric, integrated high‑speed interfaces, and the system‑level benefits described for the Stratix 10 TX device family.

This device is suited to engineering teams building high‑bandwidth networking, backplane, and data center systems that need a combination of logic density, embedded memory, and the transceiver and hard IP capabilities offered by the Stratix 10 TX architecture.

Request a quote or submit a parts inquiry to receive pricing and lead‑time information for the 1ST085EN1F43E2VG.

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