1ST085EN2F43I2LGAS

The Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 1ST085EN2F43I2LGAS is a high-density Stratix 10 TX device offering 850,000 logic elements and 440 user I/O in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package. It is specified for industrial-grade operation from -40 °C to 100 °C and RoHS compliant.

As part of the Stratix 10 TX family, this device benefits from family-level innovations such as the Intel HyperFlex core architecture, Intel 14 nm tri-gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, and dual-mode transceivers supporting both PAM4 and NRZ operation.

Key Features

• Logic Capacity  850,000 logic elements providing high gate density for complex FPGA implementations.
• Internal Memory  71,303,168 total RAM bits for on-chip buffering and storage.
• I/O  440 user I/O pins to support extensive peripheral and interface connectivity.
• Transceivers (family feature)  Dual-mode transceivers capable of up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip, chip-to-module, and backplane links (Stratix 10 TX family capability).
• Core Architecture (family feature)  Intel HyperFlex core architecture designed to deliver increased core performance compared to previous-generation high-performance FPGAs.
• Hard IP and Protocol Support (family feature)  Family-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed-Solomon FEC as documented for Stratix 10 TX devices.
• Packaging  1760-BBGA (FCBGA) surface-mount package; supplier package listed as 1760-FBGA (42.5 × 42.5 mm).
• Supply Voltage  Specified core voltage range: 820 mV to 880 mV.
• Operating Temperature  Industrial-grade range: -40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-Speed Communications  Backplane, chip-to-chip and module links leveraging the Stratix 10 TX family dual-mode transceivers for high aggregate bandwidth designs.
• Data Center & Networking  Packet processing, Ethernet MAC offload, and high-throughput switching systems that require large logic capacity and high I/O counts.
• Hardware Acceleration  Compute and algorithm acceleration where dense logic, on-chip RAM, and hardened DSP/memory controllers in the family enable complex pipelines.
• Embedded Processing Systems  Designs that can take advantage of family-level hard processor system (HPS) options and integrated IP for application-class processing.

Unique Advantages

• High logic density: 850,000 logic elements let you implement large, complex designs without external glue logic.
• Extensive on-chip memory: 71,303,168 total RAM bits reduce dependence on external memory for buffering and accelerate data-path designs.
• Broad I/O capability: 440 user I/O support large interface counts and flexible system integration.
• Family-level high-speed transceivers: Dual-mode PAM4/NRZ transceivers in the Stratix 10 TX family enable high-bandwidth links for modern communications and backplane systems.
• Industrial-grade reliability: Specified operation from -40 °C to 100 °C and RoHS compliance suitable for demanding environments.
• Advanced packaging and core technology: 14 nm FinFET core and heterogeneous 3D SiP transceiver tiles (family features) support higher performance and integration density.

Why Choose 1ST085EN2F43I2LGAS?

1ST085EN2F43I2LGAS positions itself as a high-density, industrial-grade Stratix 10 TX FPGA optimized for designs requiring substantial logic resources, large on-chip memory, and broad I/O. It brings family-level innovations—such as HyperFlex core architecture, high-speed dual-mode transceivers, and hardened protocol IP—that help designers meet demanding bandwidth and compute requirements while maintaining a compact package footprint.

This part is suited for system architects and engineers building high-throughput communications, networking, and acceleration platforms that need scalable logic capacity, robust thermal range, and extensive connectivity in a 1760-BBGA package.

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