1ST085ES1F50E2LG

The 1ST085ES1F50E2LG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC offering substantial on-chip logic and memory resources. Key silicon attributes include 841,000 logic elements and 71,303,168 total RAM bits with 440 available I/O pins.

Packaged in a 2397-BBGA (FCBGA) footprint with surface-mount mounting and an extended grade operating range, this device is intended for designs that require large logic capacity, significant on-chip memory, and a high I/O count while operating within the specified supply and temperature ranges.

Key Features

• Core Capacity  Provides 841,000 logic elements for implementing complex programmable logic and custom hardware functions.
• On-Chip Memory  Includes 71,303,168 total RAM bits to support buffering, lookup tables, and data-path storage needs within the FPGA fabric.
• I/O Resources  Features 440 I/O pins to interface with peripherals, memory, and external logic.
• Power Supply  Operates from a core voltage supply range of 870 mV to 970 mV, enabling integration into designs with defined low-voltage core rails.
• Package and Mounting  Supplied in a 2397-BBGA (FCBGA) package with supplier device package specification 2397-FBGA, FC (50×50) and designed for surface-mount assembly.
• Grade and Temperature  Extended grade device with an operating temperature range of 0 °C to 100 °C suitable for applications that operate within this thermal window.
• Compliance  RoHS compliant to meet common environmental and materials requirements.

Unique Advantages

• Large logic capacity: 841,000 logic elements enable implementation of sizeable custom hardware accelerators and complex logic architectures without external logic expansion.
• Substantial on-chip memory: 71,303,168 RAM bits reduce dependence on external memory for many buffering and data-path tasks, simplifying board-level design.
• High I/O count: 440 I/Os provide flexible interfacing options for multiple parallel buses, sensors, or high-pin-count peripherals.
• Compact system footprint: 2397-BBGA (FCBGA) packaging and surface-mount mounting allow dense PCB integration where board space is constrained.
• Controlled power envelope: Core voltage range of 870 mV to 970 mV supports designs that require defined low-voltage core operation.
• Extended operating grade: 0 °C to 100 °C rated operation and RoHS compliance support deployments within the specified thermal and environmental limits.

Why Choose 1ST085ES1F50E2LG?

The 1ST085ES1F50E2LG combines a large number of logic elements, extensive on-chip RAM, and a high I/O count in a single FCBGA package, offering a tightly integrated solution for designs that demand significant programmable resources. Its extended grade rating and defined voltage and temperature ranges provide clear operating boundaries for system planning and reliability considerations.

This device is well suited to engineering teams and procurement groups specifying FPGAs where on-chip capacity, I/O availability, package density, and RoHS compliance are primary selection criteria. The combination of resources supports scalability within projects that require substantial programmable logic and memory on a single device.

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