1ST085ES1F50E2VG

The 1ST085ES1F50E2VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 2397-BBGA FCBGA package. It provides a large logic and memory footprint with extensive I/O and is supplied in an extended grade device for surface-mount applications.

With 841,000 logic elements, 71,303,168 total RAM bits and 440 I/O pins, the device targets designs that require significant on-chip logic capacity, substantial embedded memory, and broad I/O connectivity while operating within a 770 mV to 970 mV supply window and 0 °C to 100 °C temperature range.

Key Features

• Core Capacity  841,000 logic elements provide a large programmable fabric for complex digital designs and high-density logic integration.
• On-Chip Memory  71,303,168 total RAM bits offer substantial embedded memory for buffering, state storage, and data processing tasks.
• I/O Count  440 I/O pins support wide peripheral connectivity and parallel interfaces for demanding system integration.
• Power Supply  Operates within a 770 mV to 970 mV supply range to match system power domains and design requirements.
• Package & Mounting  2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC (50×50)) intended for surface-mount assembly.
• Grade & Temperature  Extended grade device rated for 0 °C to 100 °C operating temperature.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Implement complex logic architectures and large-scale digital functions using 841,000 logic elements and extensive embedded RAM.
• Data buffering and local memory  Leverage 71,303,168 total RAM bits for on-chip buffering, packet staging, and temporary data storage in memory-heavy designs.
• Multi-interface system designs  Use 440 I/O pins to connect parallel buses, custom interfaces, and multiple peripherals without relying on external I/O expanders.

Unique Advantages

• High integration density: Consolidate complex logic and memory on-chip with 841,000 logic elements and over 71 million RAM bits, reducing external component count.
• Broad I/O availability: 440 I/O pins enable flexible connectivity for multi-channel or multi-protocol systems.
• Compact package footprint: The 2397-FBGA (50×50) package supports high-density PCB layouts while remaining surface-mount compatible.
• Power domain flexibility: Supported supply range of 770 mV to 970 mV allows integration with modern low-voltage system rails.
• Extended grade reliability: Rated for 0 °C to 100 °C operation, suitable for applications requiring extended temperature performance.
• Regulatory readiness: RoHS compliance supports environmentally responsible manufacturing and procurement.

Why Choose 1ST085ES1F50E2VG?

The 1ST085ES1F50E2VG Stratix® 10 TX FPGA combines a very large logic element count, substantial on-chip RAM, and wide I/O capability in a compact 2397-FBGA package. Its extended-grade rating and surface-mount form factor make it suitable for designs that demand high integration and robust thermal operation within the specified 0 °C to 100 °C range.

Designed and manufactured by Intel, this device is targeted at engineering teams building high-capacity FPGA-based systems that need predictable supply-voltage operation (770 mV–970 mV), extensive embedded memory, and broad connectivity while maintaining RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for 1ST085ES1F50E2VG and to discuss how this FPGA can fit into your next design.