1ST085ES1F50E1VG

The 1ST085ES1F50E1VG is a Stratix® 10 TX field programmable gate array from Intel, supplied in a 2397-BBGA FCBGA package. It delivers high on-chip resources—841,000 logic elements, 71,303,168 total RAM bits and 440 I/O—making it suited for designs that require substantial programmable logic capacity, large embedded memory and extensive I/O connectivity.

This device is an extended-grade, surface-mount FPGA that operates across a core supply range of 770 mV to 970 mV and an ambient temperature range of 0°C to 100°C. It is RoHS compliant.

Key Features

• Core Logic  Provides 841,000 logic elements to implement complex programmable logic and custom compute pipelines.
• On-Chip Memory  71,303,168 total RAM bits of embedded memory support large buffering, lookup tables and state storage directly on the FPGA.
• I/O Capacity  440 user I/O pins enable broad connectivity options for high-pin-count interfaces and multi-channel designs.
• Package and Mounting  2397-BBGA, FCBGA (supplier package 2397-FBGA, FC 50×50) delivered in a surface-mount form factor for compact board integration.
• Power  Core voltage supply range of 770 mV to 970 mV allows integration with modern low-voltage power domains.
• Temperature and Grade  Extended-grade device rated for 0°C to 100°C operating temperature range for applications within that ambient envelope.
• Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital processing  Use the device's 841,000 logic elements and large on-chip RAM to implement complex signal processing, compute pipelines and custom accelerators.
• Interface aggregation and bridging  440 I/O pins support multi-channel front-end aggregation, protocol bridging and high-pin-count connectivity between subsystems.
• Embedded memory-intensive functions  71,303,168 RAM bits enable large buffers, lookup tables and state machines that benefit from abundant on-chip memory.

Unique Advantages

• High logic capacity: The 841,000 logic elements let designers implement large-scale programmable logic without immediate need for external logic expansion.
• Substantial on-chip memory: Over 71 million RAM bits reduce dependence on external memory for buffering and state retention, simplifying board-level design.
• Extensive I/O count: 440 I/O pins provide flexibility for multi-lane interfaces, sensor arrays or parallel bus implementations.
• Compact, surface-mount packaging: 2397-BBGA FCBGA in a 50×50 footprint supports high-density PCB layouts while maintaining robust package integration.
• Extended-grade operating range: Rated for 0°C to 100°C, suitable for applications operating within this ambient range.
• Regulatory compatibility: RoHS compliance supports environmentally compliant manufacturing and assembly processes.

Why Choose 1ST085ES1F50E1VG?

The 1ST085ES1F50E1VG combines large-scale programmable logic, abundant embedded memory and significant I/O capacity in a single extended-grade Stratix® 10 TX FPGA package. These measurable resources make it appropriate for designs that require high integration of logic, memory and interfaces in a surface-mount form factor.

Designed for engineering teams that need capacity and integration—while maintaining clear electrical and thermal operating parameters—this device offers a platform to consolidate functions, reduce external components and accelerate prototype-to-production transitions within the specified voltage and temperature limits.

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