1ST085ES1F50I2VG

The 1ST085ES1F50I2VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC provided in a 2397-BBGA FCBGA package. It delivers high-density programmable logic with 841,000 logic elements and 71,303,168 bits of on-chip RAM, suited for designs that require extensive logic and memory resources.

Designed for industrial applications, this surface-mount FPGA supports 440 I/Os, operates over a 770 mV–970 mV supply range, and is rated for an operating temperature range of −40 °C to 100 °C, providing a platform for robust embedded and industrial systems.

Key Features

• Core Logic  Provides 841,000 logic elements for implementing large-scale programmable logic and custom hardware functions.
• On-Chip Memory  Includes 71,303,168 total RAM bits to support deep buffering, large LUT-based designs, and memory-intensive algorithms.
• I/O Capacity  Features 440 I/O pins to interface with complex multi-chip systems, sensors, and high-pin-count peripherals.
• Power  Operates from a 770 mV to 970 mV supply range, allowing integration into low-voltage power domains.
• Package & Mounting  Supplied in a 2397-BBGA FCBGA surface-mount package (supplier device package: 2397-FBGA, FC, 50×50), enabling compact board integration.
• Temperature & Grade  Industrial grade device rated for −40 °C to 100 °C operation, suitable for temperature-challenging environments.
• Regulatory  RoHS-compliant construction for compatibility with standard environmental requirements.

Typical Applications

• Industrial Control  Use the device’s industrial temperature rating and large logic capacity to implement control engines, protocol bridges, and deterministic processing for factory and process automation.
• Custom Hardware Acceleration  Leverage 841,000 logic elements and substantial on-chip RAM for implementing custom accelerators and data-paths in compute-intensive embedded systems.
• High-Density I/O Systems  With 440 I/Os and a compact FCBGA package, integrate multiple peripheral interfaces and high-pin-count subsystems on a single board.

Unique Advantages

• High Logic Density: 841,000 logic elements enable complex designs without partitioning across multiple FPGAs.
• Large On-Chip Memory: 71,303,168 bits of RAM reduce external memory dependence and simplify memory architectures.
• Wide I/O Count: 440 I/Os support extensive peripheral connectivity and multi-channel interfaces.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Compact Package: 2397-BBGA (2397-FBGA, 50×50) surface-mount package enables high-density board layouts while preserving connectivity.
• Low-Voltage Operation: 770 mV–970 mV supply range supports low-power system architectures and modern power domains.

Why Choose 1ST085ES1F50I2VG?

The 1ST085ES1F50I2VG positions itself as a high-capacity, industrial-grade FPGA for designs that require extensive logic resources, large on-chip memory, and broad I/O capability in a compact surface-mount package. Its combination of 841,000 logic elements, 71,303,168 bits of RAM, and 440 I/Os provides a strong foundation for implementing complex custom logic, accelerators, and multi-interface systems.

This device is well suited to engineers and system designers building industrial control equipment, custom acceleration platforms, and high-density I/O systems that require reliable operation across −40 °C to 100 °C and compatibility with low-voltage supply domains. Its form factor and specifications help simplify board integration and scale designs that demand on-chip capacity and robust thermal performance.

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