1ST250EU1F50E2LG

The 1ST250EU1F50E2LG is an Intel Stratix® 10 TX FPGA supplied in a 2397-BBGA FCBGA package. It is built on the Stratix 10 TX device family and leverages the series’ high-performance core architecture and advanced transceiver capabilities to serve demanding bandwidth‑centric designs.

This device targets applications that require large programmable fabric, high on‑chip memory capacity, and high-speed I/O. Key value propositions include a very large logic capacity, extensive RAM resources, dual-mode high‑speed transceiver support in the Stratix 10 TX family, and hardware features described in the Stratix 10 TX device overview.

Key Features

• Logic Capacity — 2,500,000 logic elements provide a large programmable fabric for complex system-on-chip implementations and high-density logic integration.
• On‑Chip Memory — Total of 204,472,320 RAM bits for large buffering, packet processing, and data‑intensive algorithms.
• I/O and Transceivers — 440 I/O pins; Stratix 10 TX series devices include dual‑mode transceivers capable of PAM4 and NRZ operation and hardened Ethernet and PCI Express IP blocks as described in the device family overview.
• Supply and Power — Core voltage supply specified from 820 mV to 880 mV to match system power rails and power‑management designs.
• Package and Mounting — 2397‑BBGA (FCBGA) supplier package (2397‑FBGA, FC 50×50) configured for surface‑mount assembly.
• Operating Conditions — Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Series Innovations — Stratix 10 TX family features such as HyperFlex core architecture, hardened compute and communications IP, and heterogeneous 3D SiP transceiver tiles are part of the device series capabilities.
• Standards Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High‑Performance Networking — Use the large logic fabric and on‑chip RAM for packet processing, traffic management, and integration with the series’ hardened Ethernet MAC and FEC capabilities.
• Data Center Accelerators — Combine abundant logic elements and memory for hardware acceleration tasks, orchestration of high‑bandwidth transceivers, and integration with PCI Express IP provided in the Stratix 10 TX family overview.
• Telecommunications — Leverage dual‑mode transceiver support and large memory resources for backplane, aggregation, and optical interface processing as described for the Stratix 10 TX series.
• Compute and Embedded Processing — Implement complex algorithms and system control with the large programmable fabric and series‑level options for embedded processor subsystems in select devices.

Unique Advantages

• Very High Logic Density: 2,500,000 logic elements enable integration of extensive custom logic and multiple subsystems on a single device, reducing external components.
• Massive On‑Chip Memory: 204,472,320 total RAM bits support large buffering and stateful processing without relying entirely on external memory.
• High‑Capacity I/O: 440 I/O pins provide flexibility for complex board interfaces and dense peripheral connectivity.
• High‑Speed Series Transceiver Technology: Stratix 10 TX family transceiver capabilities and hardened IP for Ethernet and PCIe simplify high‑bandwidth link implementations.
• Surface‑Mount FCBGA Package: 2397‑BBGA package allows compact board integration while supporting the device’s large die and I/O count.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to suit many industrial and telecom environments where extended ambient ranges are required.

Why Choose 1ST250EU1F50E2LG?

The 1ST250EU1F50E2LG positions itself as a high‑capacity FPGA option within the Stratix 10 TX family, combining millions of logic elements, hundreds of megabits of on‑chip RAM, and a large I/O complement in a single FCBGA package. It is suited to designers who need to consolidate complex logic, high‑throughput data paths, and large memory resources into a single programmable device while taking advantage of the Stratix 10 TX series’ advanced transceiver and hardened IP capabilities.

This device is appropriate for system architects and engineering teams building networking, telecom, data‑center acceleration, and other bandwidth‑intensive applications that require scalable fabric, dense memory, and robust I/O in an extended‑grade FPGA.

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