1ST250EU1F50I2VG

The 1ST250EU1F50I2VG is an Intel Stratix® 10 TX field-programmable gate array (FPGA) in a 2397-BBGA FCBGA package. It delivers a large programmable fabric—2,500,000 logic elements—paired with high on-chip memory and a wide I/O complement for demanding, high‑performance system designs.

As a member of the Stratix 10 TX family, the device leverages the family’s HyperFlex® core architecture and series transceiver/PCIe/Ethernet capabilities to address applications that require high aggregate bandwidth, extensive logic capacity, and industrial-grade operating range.

Key Features

• Core Architecture Stratix 10 TX family HyperFlex® core architecture as documented in the series overview.
• Logic Capacity 2,500,000 logic elements to implement large-scale programmable logic and custom datapaths.
• On‑Chip Memory 204,472,320 total RAM bits for deep buffering, large LUT-based structures, and state storage.
• I/O 440 I/O pins suitable for wide parallel interfaces and extensive board-level connectivity.
• High‑Speed Transceiver Technology (Series) Stratix 10 TX devices feature dual‑mode transceivers supporting PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps, and hardened MAC/PCIe IP blocks as described in the series documentation.
• Voltage and Power Core supply range 770 mV to 970 mV for the programmable fabric.
• Package & Mounting 2397‑FBGA (50 × 50 mm) FCBGA package, surface mount for high‑density board integration.
• Operating Environment Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Typical Applications

• High‑Performance Networking Large logic capacity and high on‑chip RAM enable complex packet processing, forwarding engines, and switch fabric implementations.
• Telecom & Optical Transport Series transceiver capabilities and hardened Ethernet/forward error correction IP support high‑speed line cards and backplane links.
• Data Center Acceleration Dense logic and memory resources support custom acceleration functions, inline processing, and protocol offload engines.
• Test & Measurement Extensive I/O and programmable fabric allow instrument control, data capture, and real‑time signal processing.

Unique Advantages

• Massive Logic Density: 2.5M logic elements provide the capacity to integrate large functions and multiple subsystems on a single device, reducing board complexity.
• Large On‑Chip Memory: Over 204 million bits of RAM enable deep buffering, large state machines, and memory‑intensive algorithms without relying solely on external memory.
• High I/O Count: 440 I/O pins give flexibility for broad parallel interfaces and extensive peripheral connectivity on complex boards.
• Industrial Temperature Range: Rated −40 °C to 100 °C for deployment in industrial and harsh‑environment applications.
• Advanced Packaging: 2397‑FBGA FCBGA package supports high‑density integration and thermal performance for complex system boards.
• Series-Level High‑Speed Capabilities: Stratix 10 TX series features—such as dual‑mode 57.8 Gbps PAM4 / 28.9 Gbps NRZ transceivers and hardened PCIe/Ethernet IP—provide a documented platform for high‑bandwidth system designs.

Why Choose 1ST250EU1F50I2VG?

The 1ST250EU1F50I2VG is positioned for designers who need substantial programmable logic, abundant on‑chip RAM, and a high I/O count within an industrial‑grade, surface‑mount BGA package. Its specification set supports complex networking, compute acceleration, and high‑speed communications designs where integration density and memory capacity are critical.

Selecting this Stratix 10 TX device brings the documented series advantages—HyperFlex® architecture, advanced transceiver technology, and hardened interface IP—into a high‑capacity FPGA form factor suitable for demanding system deployments that require long‑term scalability and robust operating range.

Request a quote or submit an inquiry for pricing and availability to evaluate the 1ST250EU1F50I2VG for your next high‑performance design.