1ST250EU2F50E1VG

The 1ST250EU2F50E1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) IC delivering 2,500,000 logic elements in a surface-mount 2397-BBGA (FCBGA) package. This device targets high-bandwidth system designs that require dense programmable logic, large on-chip RAM, and extensive I/O connectivity.

As part of the Stratix® 10 TX family, the device benefits from the series’ HyperFlex core architecture and high-speed transceiver technologies, enabling application use in chip-to-chip, chip-to-module, and backplane interfaces as well as systems leveraging hardened PCI Express and Ethernet MAC IP blocks described for the family.

Key Features

• Core Architecture  Built on the Intel Stratix® 10 TX family architecture, including the HyperFlex core innovations described for the series to support high-performance FPGA implementations.
• Logic Capacity  2,500,000 logic elements for implementing large, complex designs and wide parallel datapaths.
• On-Chip Memory  204,472,320 total RAM bits to support large buffering, tables, and state storage within the FPGA fabric.
• I/O  440 user I/O pins to accommodate extensive external interfacing and multi-channel connectivity needs.
• Transceiver and High‑Speed I/O (Series-Level)  Stratix® 10 TX devices support dual-mode transceivers capable of PAM4 and NRZ operation and hardened high-speed interface IP (series-level characteristics described in the device family documentation).
• Power and Voltage  Core supply operating range from 770 mV to 970 mV; designed for systems that require specific core voltage rails.
• Package and Mounting  2397-BBGA (FCBGA) package, supplier device package 2397-FBGA FC (50×50), surface-mount mounting for board-level integration.
• Operating Range and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C suitable for demanding commercial and data-center class environments.
• RoHS Compliant  Material compliance noted for environmental and regulatory planning.

Typical Applications

• Backplane and Chip-to-Module Interfaces  High-speed transceiver capabilities described for the Stratix® 10 TX family make this device suitable for chip-to-chip, chip-to-module, and backplane link implementations.
• High-Bandwidth Networking  Large logic capacity and substantial on-chip RAM support packet processing, switching, and line-rate functions in 10/25/100 Gbps Ethernet and related systems where the family’s hardened MAC IP is used.
• PCI Express-Based Systems  Series-level hardened PCI Express Gen3 IP described for Stratix® 10 TX devices supports implementation in accelerator, host, and interface cards.
• FPGA-Based Acceleration  High logic density and on-chip memory enable data-path acceleration and custom compute tasks that require extensive parallelism and buffering.

Unique Advantages

• High Logic Density:  2,500,000 logic elements provide the capacity to implement complex, large-scale FPGA designs without immediate partitioning across multiple devices.
• Substantial On‑Chip Memory:  Over 204 million RAM bits support deep buffering, large LUTRAM implementations, and stateful processing close to the fabric.
• Extensive I/O Count:  440 I/Os enable broad external connectivity and flexible board-level interface options.
• Extended Temperature Grade:  Rated for 0 °C to 100 °C operation for demanding commercial and data-center environments where extended-range operation is required.
• Advanced Package for Dense Integration:  2397-BBGA FCBGA package supports high-density routing and board-level integration in compact system designs.
• Family-Level High-Speed Capabilities:  Stratix® 10 TX-series transceiver and hardened IP capabilities (as documented for the family) give designers access to modern high-speed serial interfaces and protocol blocks.

Why Choose 1ST250EU2F50E1VG?

The 1ST250EU2F50E1VG positions itself as a high-capacity Stratix® 10 TX FPGA option for designs that require very large logic resources, extensive on-chip RAM, and broad I/O connectivity in a single, surface-mount package. Its extended temperature grade and dense FCBGA package make it suitable for systems deployed in commercial and data-center style environments.

This device is appropriate for engineering teams building high-bandwidth networking equipment, PCI Express-based cards, advanced FPGA accelerators, and backplane-interfacing systems that benefit from the Stratix® 10 TX family architecture and series-level high-speed interface capabilities described in the device documentation.

Request a quote or submit a product inquiry to get pricing and availability for the 1ST250EU2F50E1VG.