1ST250EU1F50I2LG

The 1ST250EU1F50I2LG is an Intel Stratix® 10 TX family field programmable gate array (FPGA) IC delivering very high logic density and extensive I/O for high-bandwidth systems. It implements Intel’s Hyperflex® core architecture and the Stratix 10 TX device innovations described for the series.

Stratix 10 TX devices support high-speed dual-mode transceivers and hardened interface IP, addressing demanding applications such as backplane, chip-to-chip and module links where aggregate bandwidth and integration matter. This specific device combines 2,500,000 logic elements, 204,472,320 total RAM bits, and 440 I/O in a 2397-BBGA (FCBGA) package with industrial temperature range.

Key Features

• Core architecture: Intel Hyperflex® core architecture for improved core performance as described for the Stratix 10 TX family.
• Logic capacity: 2,500,000 logic elements providing large programmable fabric for complex logic, control and packet-processing designs.
• On-chip memory: 204,472,320 total RAM bits to support large buffering, lookup tables and state storage directly on chip.
• High-speed I/O and transceivers: 440 I/O pins and Stratix 10 TX dual-mode transceivers (series capability up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ) for chip-to-chip, chip-to-module and backplane interfaces.
• Hardened interface IP (series): Stratix 10 TX devices are described with hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks and Reed-Solomon FEC options for NRZ and PAM4 signals.
• Power and supply: Nominal internal voltage supply range documented for this part is 820 mV to 880 mV.
• Package and mounting: 2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50 × 50). Surface-mount device.
• Industrial temperature rating: Rated for operation from −40 °C to 100 °C and specified as Industrial grade.
• System features (series): Stratix 10 TX devices include advanced capabilities described in the family overview such as fractional synthesis PLLs, variable-precision DSP blocks, device configuration and secure device manager, and power management features.

Typical Applications

• Backplane and high-speed switch fabric: Use the dual-mode transceivers and large logic/memory resources to implement high-throughput backplane routing, switching and aggregation functions.
• Data center acceleration and PCIe-based systems: Hardened PCI Express Gen3 IP (series) combined with large FPGA fabric enables custom accelerators and PCIe-attached processing engines.
• Optical and module interfaces: Dual-mode transceiver support for PAM4 and NRZ makes the device suitable for chip-to-module and chip-to-chip optical interface designs.
• High-speed test, measurement and signal processing: High logic density, extensive on-chip RAM and DSP capabilities (series) support complex signal processing, protocol test engines and capture/analysis tasks.

Unique Advantages

• High logic density: 2,500,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Large on-chip memory: 204,472,320 total RAM bits reduce dependence on external memory for buffering and state retention.
• Broad high-speed connectivity: 440 I/O and Stratix 10 TX family transceiver capabilities support high aggregate bandwidth for modern networking and board-level interfaces.
• Industrial temperature range: Rated −40 °C to 100 °C to meet extended environmental requirements for industrial applications.
• Integrated packaging: 2397-BBGA FCBGA footprint (supplier 2397-FBGA, 50 × 50) offers a compact, high-density platform for system-level integration.
• Series-level hardened IP and system features: Family features such as hardened Ethernet MACs, PCIe IP, DSP blocks and device configuration utilities provide building blocks for complex systems.

Why Choose 1ST250EU1F50I2LG?

The 1ST250EU1F50I2LG is positioned for high-performance, high-bandwidth designs that require large programmable fabric, substantial on-chip RAM, and extensive I/O. Its inclusion in the Stratix 10 TX family gives access to advanced core architecture and the series’ high-speed transceiver and hardened IP capabilities.

Choose this device when your design demands significant logic capacity, large internal memory, and industrial temperature operation combined with the Stratix 10 TX family feature set for connectivity and system-level integration.

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