1ST250EU2F50I1VG

The 1ST250EU2F50I1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2397‑BBGA FCBGA package targeted at high‑bandwidth, compute‑intensive designs. It combines the Intel HyperFlex® core architecture with dual‑mode high‑speed transceivers and large on‑chip RAM to address demanding networking, communications and acceleration applications.

Designed for systems that require extensive programmable logic and I/O, this device delivers a high logic element count, substantial internal memory, hardened protocol IP on the Stratix 10 TX family, and a package and thermal range suitable for industrial deployments.

Key Features

• Core & Architecture — Intel HyperFlex® core architecture; device implements 2,500,000 logic elements to support large, complex designs.
• Memory — Total on‑chip RAM of 204,472,320 bits for large buffering and scratch storage in FPGA fabric.
• High‑Speed Transceivers & I/O — Dual‑mode transceivers supporting PAM4 and NRZ operation (series capability up to 57.8 Gbps PAM4 / 28.9 Gbps NRZ) and 440 I/O pins for extensive connectivity.
• Hardened Protocol IP (Series) — Stratix 10 TX family includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks and Reed‑Solomon FEC support for NRZ and PAM4 signals.
• Packaging & Mounting — 2397‑BBGA (FCBGA) package, supplier package reference 2397‑FBGA, FC (50×50); surface mount assembly.
• Power & Supply — Core voltage supply range: 770 mV to 970 mV to match advanced low‑voltage FPGA core requirements.
• Operating Range & Compliance — Industrial grade with operating temperature range −40 °C to 100 °C; RoHS compliant.
• System & Reliability Features (Series) — Family documentation highlights device configuration, secure device manager, and SEU detection and correction capabilities.

Typical Applications

• Data center networking — High aggregate transceiver bandwidth and dense logic enable packet processing, switching and NIC offload functions.
• Telecom & optical transport — Dual‑mode PAM4/NRZ transceivers and hardened Ethernet MAC/FEC support backplane and optical module interfaces.
• High‑performance compute acceleration — Large logic element count and substantial on‑chip RAM are suitable for FPGA‑based accelerators and hardware offload engines.
• Board‑level and chip‑to‑chip interconnect — High‑speed transceiver capability for chip‑to‑chip, chip‑to‑module and backplane links in complex multi‑board systems.

Unique Advantages

• High programmable capacity: 2,500,000 logic elements provide the silicon resources required for large, multi‑function FPGA designs.
• Substantial on‑chip memory: 204,472,320 bits of RAM reduce dependency on external memory for buffering and local storage, simplifying system architectures.
• Advanced transceiver options: Dual‑mode PAM4/NRZ transceivers enable flexible deployment across modern high‑speed serial links and backplane applications.
• Hardened protocol IP (family): Integrated PCIe Gen3 and high‑speed Ethernet MAC options in the Stratix 10 TX family streamline development of common protocol functions.
• Industrial temperature and RoHS compliance: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments.
• Compact, solderable package: 2397‑BBGA FCBGA in a 50×50 supplier footprint provides a high‑density mounting solution for space‑constrained boards.

Why Choose 1ST250EU2F50I1VG?

The 1ST250EU2F50I1VG positions itself for projects that need a large programmable fabric, significant on‑chip memory, and extensive high‑speed I/O in an industrial‑rated package. Its HyperFlex core architecture and Stratix 10 TX family features support complex protocol processing, high aggregate bandwidth and advanced system integration.

This device is suited to engineering teams building high‑bandwidth networking, telecom, and compute acceleration solutions that require scalable logic resources, robust transceiver capability, and a package designed for surface‑mount assembly and industrial temperature operation.

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