1ST250EU3F50E3VG

The 1ST250EU3F50E3VG is an Intel Stratix 10 TX field programmable gate array (FPGA) in a 2397-ball BGA package, designed for high-bandwidth, high-capacity programmable systems. It implements the Intel HyperFlex core architecture and integrates high-performance transceivers and hardened IP to address demanding communications and compute-centric applications.

This device targets next-generation designs that require large fabric capacity, extensive on-chip RAM, high I/O density, and multi-gigabit serial links for chip-to-chip, chip-to-module, and backplane applications. Key value propositions include high logic capacity, abundant on-chip memory, advanced transceiver capability, and platform-level integration that supports hardened PCI Express and high-speed Ethernet IP.

Key Features

• Core & Architecture Intel HyperFlex core architecture optimized for high-performance FPGA fabric; the part provides 2,500,000 logic elements for large-scale logic implementations.
• High-Speed Transceivers Dual-mode transceivers supporting both 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation, suitable for chip-to-chip, chip-to-module, and backplane links.
• Hardened IP & Connectivity Integrated support for hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks, enabling high-throughput packet and host interfaces.
• Memory & DSP Large on-chip memory with 204,472,320 total RAM bits to support buffering and large data structures; the Stratix 10 TX family includes hardened floating-point DSP capabilities (series-level).
• I/O Capacity 440 device I/O pins provide high port density for diverse external interfaces and parallel data paths.
• Package & Mounting Supplied in a 2397-ball BGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50). Surface-mount mounting type.
• Power & Voltage Core supply voltage range specified from 770 mV to 970 mV to match system power budgets and enable power-optimized operation.
• Operating Range & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
• Platform Innovations Series-level innovations include Intel 14 nm tri-gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, and EMIB-based advanced packaging (series-level details from device family).

Typical Applications

• High‑Speed Networking and Telecom Use for line cards, switches, and routers that require multi-gigabit links and hardened Ethernet MACs with forward error correction.
• Backplane and Module Interconnect Ideal for reliable chip-to-chip and module-to-module connections over backplanes or high-density interconnects using PAM4 or NRZ serial links.
• Data and Storage Connectivity Application where PCI Express Gen3 and high-throughput packet processing are needed for host interfaces and storage controllers.
• Compute Acceleration and Signal Processing Suitable for hardware-accelerated datapaths and DSP workloads that leverage the device’s large logic capacity and on-chip RAM.

Unique Advantages

• Large Fabric Capacity: 2,500,000 logic elements enable complex, high‑function designs without immediate partitioning across multiple devices.
• Massive On‑Chip Memory: 204,472,320 total RAM bits support deep buffering, large lookup tables, and memory-intensive algorithms on-chip.
• High I/O Density: 440 I/O pins provide flexibility for parallel interfaces, numerous differential pairs, or mixed-signal connectivity on a single device.
• Advanced SerDes Performance: Dual-mode transceivers supporting 57.8 Gbps PAM4 and 28.9 Gbps NRZ enable high-bandwidth links for modern communications topologies.
• Integrated Hardened IP: Built-in PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP reduce integration effort for host and network interfaces.
• Platform-Level Integration: Family-level innovations such as HyperFlex core architecture and advanced packaging enhance throughput and system-level integration.

Why Choose 1ST250EU3F50E3VG?

The 1ST250EU3F50E3VG Stratix 10 TX FPGA combines high fabric capacity, extensive on-chip memory, and advanced serial connectivity to address high-bandwidth, compute‑driven systems. Its dual-mode high-speed transceivers and hardened host/network IP make it well-suited for designs requiring substantial aggregate bandwidth and dense I/O.

This device is positioned for engineers building next-generation communications, compute acceleration, and interconnect systems that need scalable logic resources, robust on-chip RAM, and platform-level features from the Stratix 10 TX family. The extended-grade temperature range and RoHS compliance support deployment in a wide range of commercial and enterprise environments.

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