1ST250EU2F50I2VGAS

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2500000 2397-BBGA, FCBGA

Quantity 466 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1ST250EU2F50I2VGAS – Stratix® 10 TX Field Programmable Gate Array (FPGA) IC

The 1ST250EU2F50I2VGAS is an Intel Stratix 10 TX FPGA in a 2397-BBGA FCBGA package, purpose-built for high-bandwidth, high-density digital logic and I/O applications. It leverages the Intel HyperFlex™ core architecture and the Stratix 10 TX device innovations to deliver a combination of large logic capacity, extensive on-chip memory, and high-speed transceiver capability.

Targeted at designs that require large programmable fabric and robust I/O, this industrial-grade device provides high logic density, a broad operating temperature range, and support for advanced transceiver and hardened interface IP available across the Stratix 10 TX family.

Key Features

  • Core Architecture  Intel HyperFlex™ core architecture, designed to improve core performance and enable high-throughput logic implementations.
  • Logic Capacity  2,500,000 logic elements for complex, large-scale FPGA designs and dense algorithm implementations.
  • Embedded Memory  204,472,320 total RAM bits to support on-chip buffering, large state machines, and memory-intensive processing.
  • High-Speed I/O  440 I/O pins to interface with external devices, memories, and high-speed interconnects.
  • Dual‑Mode Transceivers (Series Feature)  Stratix 10 TX series includes power-efficient, dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, chip-to-module, and backplane links.
  • Hardened Interface IP (Series Feature)  Stratix 10 TX family features hardened PCI Express Gen3 and multi-rate Ethernet MAC IP (10/25/100 Gbps) to simplify integration of common high-speed protocols.
  • Package & Mounting  2397-BBGA (FCBGA) supplier package, surface-mountable, designed for dense board-level integration.
  • Power and Thermal  Specified core voltage range of 770 mV to 970 mV and industrial operating temperature range of −40 °C to 100 °C.
  • Industrial Grade  Designated industrial grade for use in systems requiring extended temperature operation.

Typical Applications

  • High-Speed Networking and Optical Transport  Leverage the series’ dual-mode transceivers and hardened Ethernet MAC IP for high-bandwidth link aggregation, line cards, and optical transport modules.
  • Backplane and Module Interconnects  Support chip-to-module and backplane communication with transceiver rates suited for modern backplane architectures.
  • Data Center and Telecom Systems  Deploy large logic capacity and on-chip RAM to implement packet processing, switching fabric, and protocol offload functions.
  • Accelerators and High‑Performance Logic  Use high logic density and abundant memory for FPGA-based acceleration, signal processing, and algorithmic offload tasks.

Unique Advantages

  • Highly Scalable Logic Capacity:  2.5 million logic elements provide headroom for complex designs and feature growth without changing device families.
  • Extensive On‑Chip Memory:  Over 204 million RAM bits to reduce external memory dependence and improve data locality for latency-sensitive functions.
  • Advanced High-Speed I/O:  Dual-mode transceivers and 440 I/O allow integration of a wide range of high-throughput interfaces and multi-lane links.
  • Industrial Reliability:  Qualified for operation from −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
  • System-Level Integration:  Stratix 10 TX family features—including hardened PCIe and Ethernet MAC IP—help shorten development and simplify system integration.

Why Choose 1ST250EU2F50I2VGAS?

The 1ST250EU2F50I2VGAS combines very large programmable fabric, substantial on-chip memory, and extensive I/O in a 2397-BBGA FCBGA package, making it suitable for engineers building high-bandwidth, logic‑dense systems. Its inclusion in the Stratix 10 TX family aligns it with advanced core architecture and high-speed transceiver capabilities tailored to next-generation communications and processing applications.

This device is a fit for teams that need a scalable FPGA platform with industrial temperature capability, significant logic and memory resources, and high-speed interface options provided across the Stratix 10 TX family.

Request a quote or submit a sales inquiry for part number 1ST250EU2F50I2VGAS to receive pricing and availability details.

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