1ST250EU3F50E3XG

The 1ST250EU3F50E3XG is an Intel Stratix® 10 TX FPGA in a high-density FCBGA package, delivering up to 2,500,000 logic elements and 204,472,320 bits of on‑chip RAM. Built for designs that require very large programmable fabric, extensive memory, and substantial I/O bandwidth, this device targets high-performance communications, data center, and compute-acceleration systems.

Based on the Stratix 10 TX family architecture, the device benefits from the series’ advanced core innovations (including the Intel HyperFlex® core architecture and heterogeneous packaging approaches described in the device overview), while offering a large I/O complement and a low-voltage core supply for power-optimized system integration.

Key Features

• Logic Capacity  Provides 2,500,000 logic elements to implement large, complex FPGA designs and high-density custom logic.
• On‑Chip Memory  Total RAM of 204,472,320 bits to support large buffering, packet processing, and on‑chip data structures.
• High‑Speed I/O  440 I/O pins support broad external connectivity for interfaces, memory, and high-speed links.
• Advanced Transceiver and Fabric Innovations  Part of the Stratix 10 TX family which includes the HyperFlex core architecture and high-performance transceiver technology described in the device overview.
• Power and Voltage  Core supply voltage range specified at 820 mV to 880 mV for system power planning and regulator selection.
• Package and Mounting  2397‑BBGA (FCBGA) package; supplier device package listed as 2397‑FBGA, FC (50×50). Surface-mount mounting type supports standard PCB assembly flows.
• Operating Range and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C suitable for controlled-environment, high-performance systems.
• Compliance  RoHS‑compliant for environmental regulatory considerations.

Typical Applications

• High‑Bandwidth Networking  Used in line cards and switch fabric applications where large logic capacity and high aggregate I/O bandwidth are required.
• Data Center Acceleration  Implements custom acceleration pipelines, packet processing, and large on‑chip memory buffers for low‑latency compute tasks.
• Telecommunications Equipment  Supports systems that need programmable protocol handling and flexible I/O bandwidth for next‑generation transport links.
• High‑Performance Test & Measurement  Deploys large logic designs and substantial RAM for real‑time signal processing and data capture workloads.

Unique Advantages

• High Logic Density: 2,500,000 logic elements enable integration of large systems on a single device, reducing the need for multiple FPGAs.
• Large On‑Chip Memory: 204,472,320 bits of RAM provide ample capacity for buffering, packet queues, and dataflow acceleration without immediate external memory dependence.
• Broad I/O Count: 440 I/Os accommodate multiple interfaces and parallel external devices for flexible board-level integration.
• Power‑Optimized Core Supply: Narrow core voltage range (820 mV–880 mV) supports efficient power delivery and regulator selection for dense systems.
• FCBGA Packaging: 2397‑FBGA/BBGA package in a 50×50 form factor supports high-pin-count, high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to meet the requirements of many high-performance electronic systems.

Why Choose 1ST250EU3F50E3XG?

The 1ST250EU3F50E3XG positions itself as a high-capacity Stratix 10 TX FPGA for designs that demand substantial programmable logic, significant on‑chip memory, and extensive I/O. Its specifications—2.5 million logic elements, over 204 million bits of RAM, and 440 I/Os—make it suitable for complex networking, acceleration, and telecommunication platforms where consolidation of functions into a single, scalable device reduces board complexity.

As part of the Stratix 10 TX family, this device aligns with a product line engineered for high aggregate bandwidth and advanced fabric features, providing a pathway for scalable designs that require long-term performance and integration headroom.

Request a quote or submit a procurement inquiry to evaluate 1ST250EU3F50E3XG for your next high-performance FPGA design.