1ST250EY1F55E2LG

IC FPGA 296 I/O 2912BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2500000 2912-BBGA, FCBGA

Quantity 815 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O296Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1ST250EY1F55E2LG – Stratix® 10 TX FPGA, 2,500,000 logic elements, 2912‑BBGA FCBGA

The 1ST250EY1F55E2LG is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2912‑BBGA FCBGA package. It pairs a high‑capacity FPGA fabric (2,500,000 logic elements) with advanced Stratix 10 TX series innovations—including the HyperFlex® core architecture and high‑speed transceivers—to address high‑bandwidth, high‑density system designs.

Purpose-built for applications that require extensive logic, abundant on‑chip memory, and multi‑gigabit serial I/O, this device delivers a combination of integration, performance and power characteristics suited to demanding communications, networking and compute environments.

Key Features

  • Core & Architecture 
    HyperFlex® core architecture from the Stratix 10 TX family implemented in this device, delivering the series' architectural performance advantages.
  • Logic Capacity 
    2,500,000 logic elements provide large programmable fabric capacity for complex algorithms and parallel processing pipelines.
  • On‑chip Memory 
    204,472,320 total RAM bits for deep buffering, large lookup tables and on‑device data storage.
  • High‑speed Transceivers 
    Stratix 10 TX series dual‑mode transceivers support both PAM4 and NRZ operation (series capability up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ), enabling chip‑to‑chip, chip‑to‑module and backplane links.
  • Hard IP Blocks (Series) 
    The Stratix 10 TX family includes hardened IP such as PCI Express Gen3 and multi‑rate Ethernet MACs with Reed‑Solomon FEC support (10/25/100 Gbps), as described in the series documentation.
  • I/O and Package 
    296 general‑purpose I/Os and a 2912‑BBGA (55 mm × 55 mm) FCBGA supplier package enable dense system interfaces in a surface‑mount form factor.
  • Power Supply 
    Core voltage supply range specified at 820 mV to 880 mV for the device core.
  • Operating Range & Grade 
    Extended grade device with an operating temperature range of 0 °C to 100 °C; RoHS compliant.

Typical Applications

  • High‑speed Networking & Switches 
    Used for packet processing, MAC/PHY bridging and backplane interfaces where multi‑Gbps transceiver bandwidth and large logic capacity are required.
  • Data Center & Infrastructure 
    Suitable for acceleration, NIC/SmartNIC functionality and protocol offload engines that need extensive on‑chip memory and programmable logic.
  • Telecommunications & Optical Transport 
    Ideal for line cards and transport systems leveraging the series' dual‑mode transceivers and hardened Ethernet IP.
  • Test, Measurement & Probe Systems 
    Deployments that require deep buffering, custom processing pipelines and flexible I/O mapping benefit from the device's large RAM and abundant I/O.

Unique Advantages

  • High programmable capacity: 2.5 million logic elements enable complex, parallel designs and large custom state machines without immediate need for external processors.
  • Large on‑chip memory: 204,472,320 RAM bits reduce dependence on external DRAM for buffering and accelerate memory‑heavy processing tasks.
  • Multi‑rate serial connectivity: Series‑level transceiver capability for PAM4 and NRZ modes supports modern high‑bandwidth links for backplane and chip‑to‑chip applications.
  • Compact, high‑density package: 2912‑BBGA FCBGA with 296 I/Os provides a compact footprint for dense system integration while supporting surface‑mount assembly.
  • Power‑aware core supply: Core voltage specified at 0.82–0.88 V to match planned power‑delivery designs and manage thermal profile.
  • Extended operating grade and RoHS compliance: Rated 0 °C to 100 °C and RoHS compliant to meet regulatory and environmental requirements for a wide set of deployments.

Why Choose 1ST250EY1F55E2LG?

The 1ST250EY1F55E2LG combines the Stratix 10 TX series' advanced architecture with a high logic element count, substantial on‑chip memory and series‑class high‑speed transceivers—packaged in a 2912‑BBGA FCBGA form factor. It is positioned for system designs that demand both massive programmable resources and multi‑gigabit connectivity in a single surface‑mount device.

This device is appropriate for development teams and procurement groups building solutions in networking, telecommunications, data center infrastructure and measurement systems who need scalable logic capacity, large internal RAM, and the Stratix 10 TX feature set in an extended‑grade FPGA.

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