1ST250EY1F55E2LG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2500000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 815 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA, FC (55x55) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 296 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1ST250EY1F55E2LG – Stratix® 10 TX FPGA, 2,500,000 logic elements, 2912‑BBGA FCBGA
The 1ST250EY1F55E2LG is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2912‑BBGA FCBGA package. It pairs a high‑capacity FPGA fabric (2,500,000 logic elements) with advanced Stratix 10 TX series innovations—including the HyperFlex® core architecture and high‑speed transceivers—to address high‑bandwidth, high‑density system designs.
Purpose-built for applications that require extensive logic, abundant on‑chip memory, and multi‑gigabit serial I/O, this device delivers a combination of integration, performance and power characteristics suited to demanding communications, networking and compute environments.
Key Features
- Core & Architecture
HyperFlex® core architecture from the Stratix 10 TX family implemented in this device, delivering the series' architectural performance advantages. - Logic Capacity
2,500,000 logic elements provide large programmable fabric capacity for complex algorithms and parallel processing pipelines. - On‑chip Memory
204,472,320 total RAM bits for deep buffering, large lookup tables and on‑device data storage. - High‑speed Transceivers
Stratix 10 TX series dual‑mode transceivers support both PAM4 and NRZ operation (series capability up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ), enabling chip‑to‑chip, chip‑to‑module and backplane links. - Hard IP Blocks (Series)
The Stratix 10 TX family includes hardened IP such as PCI Express Gen3 and multi‑rate Ethernet MACs with Reed‑Solomon FEC support (10/25/100 Gbps), as described in the series documentation. - I/O and Package
296 general‑purpose I/Os and a 2912‑BBGA (55 mm × 55 mm) FCBGA supplier package enable dense system interfaces in a surface‑mount form factor. - Power Supply
Core voltage supply range specified at 820 mV to 880 mV for the device core. - Operating Range & Grade
Extended grade device with an operating temperature range of 0 °C to 100 °C; RoHS compliant.
Typical Applications
- High‑speed Networking & Switches
Used for packet processing, MAC/PHY bridging and backplane interfaces where multi‑Gbps transceiver bandwidth and large logic capacity are required. - Data Center & Infrastructure
Suitable for acceleration, NIC/SmartNIC functionality and protocol offload engines that need extensive on‑chip memory and programmable logic. - Telecommunications & Optical Transport
Ideal for line cards and transport systems leveraging the series' dual‑mode transceivers and hardened Ethernet IP. - Test, Measurement & Probe Systems
Deployments that require deep buffering, custom processing pipelines and flexible I/O mapping benefit from the device's large RAM and abundant I/O.
Unique Advantages
- High programmable capacity: 2.5 million logic elements enable complex, parallel designs and large custom state machines without immediate need for external processors.
- Large on‑chip memory: 204,472,320 RAM bits reduce dependence on external DRAM for buffering and accelerate memory‑heavy processing tasks.
- Multi‑rate serial connectivity: Series‑level transceiver capability for PAM4 and NRZ modes supports modern high‑bandwidth links for backplane and chip‑to‑chip applications.
- Compact, high‑density package: 2912‑BBGA FCBGA with 296 I/Os provides a compact footprint for dense system integration while supporting surface‑mount assembly.
- Power‑aware core supply: Core voltage specified at 0.82–0.88 V to match planned power‑delivery designs and manage thermal profile.
- Extended operating grade and RoHS compliance: Rated 0 °C to 100 °C and RoHS compliant to meet regulatory and environmental requirements for a wide set of deployments.
Why Choose 1ST250EY1F55E2LG?
The 1ST250EY1F55E2LG combines the Stratix 10 TX series' advanced architecture with a high logic element count, substantial on‑chip memory and series‑class high‑speed transceivers—packaged in a 2912‑BBGA FCBGA form factor. It is positioned for system designs that demand both massive programmable resources and multi‑gigabit connectivity in a single surface‑mount device.
This device is appropriate for development teams and procurement groups building solutions in networking, telecommunications, data center infrastructure and measurement systems who need scalable logic capacity, large internal RAM, and the Stratix 10 TX feature set in an extended‑grade FPGA.
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