1ST250EY1F55E1VG

The 1ST250EY1F55E1VG is an Intel Stratix® 10 TX field‑programmable gate array supplied in a 2912‑FBGA (55×55) flip‑chip BGA package. It implements the Stratix 10 TX family architecture—designed for high logic density, advanced transceiver capability, and system‑level integration—addressing demanding, bandwidth‑centric designs.

This device combines 2,500,000 logic elements and 312,500 ALMs with 204,472,320 bits of on‑chip RAM and 296 I/O pins, delivering the resources required for large FPGA designs while operating within a 770 mV to 970 mV core supply range and an extended temperature grade of 0 °C to 100 °C.

Key Features

• Core Architecture  Stratix 10 TX family architecture with Intel HyperFlex‑class innovations as documented for the family, providing the high logic density found in this device (2,500,000 logic elements, 312,500 ALMs).
• Logic Capacity  2,500,000 logic elements and 312,500 ALMs to support large, complex designs and deep datapath implementations.
• On‑Chip Memory  204,472,320 bits of total RAM for large buffering, lookup tables, and state storage within the FPGA fabric.
• I/O and Transceivers  296 I/O pins to interface with external components and system buses; the Stratix 10 TX family includes dual‑mode transceiver capability for high‑speed serial links as documented for the family.
• Power and Voltage  Core voltage supply range of 770 mV to 970 mV to support the device’s power domains and performance states.
• Package and Mounting  2912‑BBGA / 2912‑FBGA (55×55) flip‑chip BGA packaging, surface‑mountable for board‑level integration.
• Temperature Grade  Extended grade with an operating range of 0 °C to 100 °C for applications requiring a wider commercial temperature window.
• Standards Compliance  RoHS compliant for regulatory and assembly considerations.

Typical Applications

• High‑bandwidth Networking and Telecom  Used in line cards, backplane interfaces, and routing platforms where high logic density and the Stratix 10 TX family’s transceiver capabilities meet demanding bandwidth requirements.
• Data Center and Compute Acceleration  Deployed to implement complex packet processing, custom acceleration, and aggregation functions that benefit from large on‑chip memory and abundant logic resources.
• Backplane and Chip‑to‑Module Interconnect  Suited for designs requiring large FPGA fabric plus high‑speed serial links and dense I/O to connect modules and boards.

Unique Advantages

• High logic density: 2,500,000 logic elements and 312,500 ALMs provide the capacity for very large designs without partitioning across multiple devices.
• Large embedded RAM: 204,472,320 bits of on‑chip RAM reduce external memory dependence for buffering and state storage, simplifying board design.
• Broad I/O count: 296 I/O pins enable flexible interfacing with high‑pin‑count systems and multiple external peripherals.
• Extended temperature rating: 0 °C to 100 °C operating range meets broader commercial environmental requirements.
• Production‑ready package: 2912‑FBGA (55×55) surface‑mount package supports standard assembly flows for high‑density boards.
• Regulatory compliance: RoHS compliance supports environmentally regulated product requirements.

Why Choose 1ST250EY1F55E1VG?

1ST250EY1F55E1VG positions designers to implement large, bandwidth‑oriented FPGA systems by combining very high logic element count with substantial on‑chip RAM and a broad I/O set in a production‑grade BGA package. The device leverages the Stratix 10 TX family architecture and associated capabilities to address complex packet processing, high‑performance compute acceleration, and backplane interconnect applications.

For teams targeting scalable, integration‑focused system designs that require significant programmable fabric and memory resources, this device delivers measurable integration and board‑level simplification while meeting extended commercial environmental ranges and RoHS requirements.

Request a quote or submit an inquiry for pricing and availability to move your design forward with 1ST250EY1F55E1VG.