1ST250EY1F55I2VG

The 1ST250EY1F55I2VG is an Intel Stratix 10 TX Field Programmable Gate Array (FPGA) in a 2912‑BBGA FCBGA package. It pairs the Intel HyperFlex core architecture and high-capacity programmable fabric with dual‑mode high-speed transceivers and hardened IP blocks targeted at demanding communications, networking and compute‑intensive applications.

With 2,500,000 logic elements, extensive on‑chip RAM and 296 I/Os, this device is designed for system designs that require high aggregate bandwidth, deep internal memory, and industrial operating range.

Key Features

• Core Architecture Intel HyperFlex core architecture derived from the Stratix 10 TX family to deliver improved core performance for complex logic implementations.
• Logic Capacity 2,500,000 logic elements to support large, high‑density designs and complex datapath implementations.
• On‑Chip Memory 204,472,320 total RAM bits of internal memory capacity for buffering, packet processing, and large state storage.
• High‑Speed Transceivers Dual‑mode transceivers in the Stratix 10 TX family support PAM4 and NRZ signaling with data rates up to the family‑specified 57.8 Gbps (PAM4) and 28.9 Gbps (NRZ), enabling chip‑to‑chip, chip‑to‑module, and backplane interconnects.
• Hardened Interfaces and IP Family features include hardened PCI Express Gen3 and multi‑rate Ethernet MACs with Reed‑Solomon FEC options, delivering protocol offload and deterministic timing for high‑throughput links.
• I/O and Packaging 296 user I/Os in a 2912‑BBGA FCBGA package (supplier package 2912‑FBGA, FC 55×55) for high pin‑count system integration and dense board routing.
• Power and Supply Core voltage supply range of 770 mV to 970 mV to match system power delivery requirements for the device class.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Packaging and Integration Technology Stratix 10 TX devices use Intel 14 nm FinFET process and heterogeneous 3D SiP packaging innovations described for the family to deliver high performance and integration density.
• Regulatory Compliance RoHS‑compliant construction for regulatory and manufacturing consistency.

Typical Applications

• High‑Speed Networking and Telecom Implement line cards, packet processing, and backplane interface functions leveraging high aggregate bandwidth and hardened Ethernet/PCIe IP.
• Data Center and Acceleration Use as a compute‑centric FPGA fabric for custom accelerators, offload engines, or aggregation functions requiring deep on‑chip memory and large logic capacity.
• Chip‑to‑Module and Backplane Interfaces Deploy in systems requiring high‑rate PAM4/NRZ transceiver lanes for chip‑to‑chip, chip‑to‑module, or backplane connectivity.
• Industrial Communications and Control Leverage the device’s industrial temperature rating and robust I/O count for demanding industrial networking and control applications.

Unique Advantages

• High Logic Density: 2.5M logic elements enable consolidation of large functions and multiple subsystems into a single FPGA, reducing board complexity.
• Massive On‑Chip Memory: Over 204 million bits of internal RAM facilitate large buffers and stateful processing without immediate reliance on external memory.
• Multi‑Mode High‑Speed I/O: Dual‑mode transceivers and hardened MAC/PCIe IP provide flexibility to support evolving high‑speed interface requirements while offloading protocol work from fabric logic.
• Industrial Thermal Range: −40 °C to 100 °C rating supports deployment in extended temperature industrial environments.
• Advanced Packaging: 2912‑BBGA FCBGA footprint and family packaging approaches enable dense routing and system integration in space‑constrained designs.
• Standards‑oriented IP: Inclusion of hardened PCIe Gen3 and Ethernet MAC options in the Stratix 10 TX family simplifies integration of standard interfaces.

Why Choose 1ST250EY1F55I2VG?

The 1ST250EY1F55I2VG brings high logic density, substantial internal RAM, and a broad set of high‑speed I/O capabilities in a single industrial‑rated FPGA package. It is positioned for engineers building high‑bandwidth networking, telecom, data center acceleration, and industrial systems that require large programmable fabric, deep on‑chip memory, and multi‑rate transceiver support.

Choosing this Stratix 10 TX device gives designers access to the family’s HyperFlex architecture, high‑rate transceivers and hardened protocol IP, enabling scalable system architectures and a clear upgrade path within the Stratix 10 TX lineup.

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